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ISO7810 Datasheet Preview

ISO7810 Datasheet

Single-Channel Digital Isolator

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ISO7810, ISO7810F
SLLSEP1B – JULY 2015 – REVISED JUNE 2016
ISO7810x High-Performance, 8000-VPK Reinforced Single-Channel Digital Isolator
1 Features
1 Signaling Rate: Up to 100 Mbps
• Wide Supply Range: 2.25 V to 5.5 V
• 2.25 V to 5.5 V Level Translation
• Wide Temperature Range: –55°C to 125°C
• Low Power Consumption, Typical 1.8 mA at
1 Mbps
• Low Propagation Delay: 10.7 ns Typical
(5 V Supplies)
• Industry leading CMTI (Min): ±100 kV/μs
• Robust Electromagnetic Compatibility (EMC)
• System-Level ESD, EFT, and Surge Immunity
• Low Emissions
• Isolation Barrier Life: > 40 Years
• SOIC-16 Wide Body (DW) and Extra-Wide Body
(DWW) Package Options
• Safety-Related Certifications:
– 8000 VPK Reinforced Isolation per DIN V VDE
V 0884-10 (VDE V 0884-10):2006-12
– 5.7 kVRMS Isolation for 1 minute per UL 1577
– CSA Component Acceptance Notice 5A, IEC
60950-1 and IEC 60601-1 End Equipment
Standards
– CQC Certification per GB4943.1-2011
– TUV Certification per EN 61010-1 and EN
60950-1
– All DW Package Certifications Complete;
DWW Package Certifications Complete per
UL, VDE, and TUV and Planned for CSA and
CQC
3 Description
The ISO7810x device is a high-performance, single-
channel digital isolator with 8000 VPK isolation
voltage. This device has reinforced isolation
certifications according to VDE, CSA, CQC, and TUV.
The isolator provides high electromagnetic immunity
and low emissions at low power consumption, while
isolating CMOS or LVCMOS digital I/Os.
The isolation channel has a logic input and output
buffer separated by silicon dioxide (SiO2) insulation
barrier. If the input power or signal is lost, the default
output is high for the ISO7810 and low for the
ISO7810F device. See the Device Functional Modes
section for further details.
Used in conjunction with isolated power supplies, this
device helps prevent noise currents on a data bus or
other circuits from entering the local ground and
interfering with or damaging sensitive circuitry.
Through innovative chip design and layout
techniques, electromagnetic compatibility of the
ISO7810x device has been significantly enhanced to
ease system-level ESD, EFT, surge, and emissions
compliance. The ISO7810x device is available in 16-
pin SOIC wide-body (DW) and extra-wide body
(DWW) packages.The DWW package option comes
with enable pin which can be used to put the output
in high impedance state for multi-master driving
applications and to reduce power consumption.
Device Information(1)
PART NUMBER PACKAGE
BODY SIZE (NOM)
ISO7810
ISO7810F
DW (16)
DWW (16)
10.30 mm × 7.50 mm
10.30 mm × 14.0 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
2 Applications
• Industrial Automation
• Motor Control
• Power Supplies
• Solar Inverters
• Medical Equipment
• Hybrid Electric Vehicles
Simplified Schematic
VCC1
Isolation
Capacitor
VCC2
IN OUT
EN2 (DWW package only)
GND1
GND2
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.




etcTI

ISO7810 Datasheet Preview

ISO7810 Datasheet

Single-Channel Digital Isolator

No Preview Available !

ISO7810, ISO7810F
SLLSEP1B – JULY 2015 – REVISED JUNE 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ..................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 6
6.5 Power Rating............................................................. 6
6.6 Insulation Characteristics ......................................... 7
6.7 Regulatory Information.............................................. 8
6.8 Safety Limiting Values .............................................. 8
6.9 Electrical Characteristics—5-V Supply ..................... 9
6.10 Supply Current Characteristics—5-V Supply .......... 9
6.11 Electrical Characteristics—3.3-V Supply .............. 10
6.12 Supply Current Characteristics—3.3-V Supply ..... 10
6.13 Electrical Characteristics—2.5-V Supply .............. 11
6.14 Supply Current Characteristics—2.5-V Supply ..... 11
6.15 Switching Characteristics—5-V Supply................. 12
6.16 Switching Characteristics—3.3-V Supply.............. 12
6.17 Switching Characteristics—2.5-V Supply.............. 13
6.18 Insulation Characteristics Curves ......................... 14
6.19 Typical Characteristics .......................................... 15
7 Parameter Measurement Information ................ 16
8 Detailed Description ............................................ 18
8.1 Overview ................................................................. 18
8.2 Functional Block Diagram ....................................... 18
8.3 Feature Description................................................. 19
8.4 Device Functional Modes........................................ 20
9 Applications and Implementation ...................... 21
9.1 Application Information............................................ 21
9.2 Typical Application .................................................. 21
10 Power Supply Recommendations ..................... 23
11 Layout................................................................... 24
11.1 Layout Guidelines ................................................. 24
11.2 Layout Example .................................................... 24
12 Device and Documentation Support ................. 25
12.1 Documentation Support ........................................ 25
12.2 Related Links ........................................................ 25
12.3 Receiving Notification of Documentation Updates 25
12.4 Community Resources.......................................... 25
12.5 Trademarks ........................................................... 25
12.6 Electrostatic Discharge Caution ............................ 25
12.7 Glossary ................................................................ 25
13 Mechanical, Packaging, and Orderable
Information ........................................................... 26
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (September 2015) to Revision B
Page
• Changed Features From: Low Power Consumption, Typical 1.8 mA per Channel at 1 Mbps To: Low Power
Consumption, Typical 1.8 mA at 1 Mbps................................................................................................................................ 1
• Changed Features From: Low Propagation Delay: 11 ns Typical To: Low Propagation Delay: 10.7 ns Typical ................. 1
• Changed Features From: Safety and Regulatory Approvals To: Safety-Related Certifications ........................................... 1
• Added the extra-wide body package (16 pin SOIC [DWW]) option........................................................................................ 1
• Changed the INA, OUTA, VCCI, and VCCO pin names to IN, OUT, VCC1, and VCC2 (respectively) and updated the pin
out drawings, Pin Functions table, and other figures to match ............................................................................................. 4
• Moved Junction temperature From Recommended Operating Conditions To Absolute Maximum Ratings ......................... 5
• Changed the Thermal Information values for the DW package and add the values for the DWW package ........................ 6
• Changed the values in the Power Rating table ..................................................................................................................... 6
• Moved Insulation Characteristics to the Specifications section ............................................................................................. 7
• Changed CIO Specification From: 2 pF To: ~0.75 pF ............................................................................................................ 7
• Moved Regulatory Information to the Specifications section ................................................................................................. 8
• Moved Safety Limiting Values to the Specifications section ................................................................................................. 8
• Changed the minimum CMTI value from 50 to 100 and deleted the maximum value in the 5-V and 3.3-V electrical
characteristics tables. Also added VCM to the test conditions ................................................................................................ 9
• Changed the maximum value for the supply current, AC parameter at 100 Mbps in all of the electrical characteristics
tables ..................................................................................................................................................................................... 9
• Changed the minimum CMTI value from 70 to 100 and deleted the maximum value in the 2.5-V electrical
characteristics table. Also added VCM to the test conditions ................................................................................................ 11
• Added the disable and enable propagation delay parameters to all of the switching characteristics tables ...................... 12
2 Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: ISO7810 ISO7810F


Part Number ISO7810
Description Single-Channel Digital Isolator
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