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ISO7830 Datasheet Preview

ISO7830 Datasheet

Triple Digital Isolators

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ISO7830, ISO7830F

SLLSEO2B – JULY 2015 – REVISED JUNE 2016

ISO7830x High-Performance, 8000-VPK Reinforced Triple Digital Isolators

1 Features

•1 Signaling Rate: Up to 100 Mbps

• Wide Supply Range: 2.25 V to 5.5 V

• 2.25 V to 5.5 V Level Translation

• Wide Temperature Range: –55°C to 125°C

• Low Power Consumption, Typical 1.6 mA per

Channel at 1 Mbps

• Low Propagation Delay: 11 ns Typical

(5-V Supplies)

• Industry leading CMTI (min): ±100 kV/μs

• Robust Electromagnetic Compatibility (EMC)

• System-Level ESD, EFT, and Surge Immunity

• Low Emissions

• Isolation Barrier Life: > 40 Years

• SOIC-16 Wide Body (DW) and Extra-Wide Body

(DWW) Package Options

• Safety-Related Certifications:

– 8000 VPK Reinforced Isolation per DIN V VDE

V 0884-10 (VDE V 0884-10):2006-12

– 5.7 kVRMS Isolation for 1 Minute per UL 1577

– CSA Component Acceptance Notice 5A, IEC

60950-1 and IEC 60601-1 End Equipment

Standards

– CQC Certification per GB4943.1-2011

– TUV Certification per EN 61010-1 and EN

60950-1

– All DW Package Certifications Complete;

DWW Package Certifications Complete per

UL, VDE, TUV and Planned for CSA and CQC

2 Applications

Each isolation channel has a logic input and output

buffer separated by silicon dioxide (SiO2) insulation

barrier. This device comes with enable pins which

can be used to put the respective outputs in high

impedance for multi-master driving applications and

to reduce power consumption. The ISO7830x device

has three forward and no reverse-direction channels.

If the input power or signal is lost, the default output

is high for the ISO7830 device and low for the

ISO7830F device. See Device Functional Modes for

further details.

Used in conjunction with isolated power supplies, this

device helps prevent noise currents on a data bus or

other circuits from entering the local ground and

interfering with or damaging sensitive circuitry.

Through innovative chip design and layout

techniques, electromagnetic compatibility of

ISO7830x has been significantly enhanced to ease

system-level ESD, EFT, surge, and emissions

compliance. ISO7830x is available in a 16-pin SOIC

wide-body (DW) and extra-wide body (DWW)

packages.

Device Information(1)

PART NUMBER PACKAGE

BODY SIZE (NOM)

ISO7830

ISO7830F

DW (16)

DWW (16)

10.30 mm × 7.50 mm

10.30 mm × 14.0 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Simplified Schematic

VCCI

Isolation

Capacitor

VCCO

INx OUTx

ENx

• Industrial Automation

• Motor Control

• Power Supplies

• Solar Inverters

• Medical Equipment

• Hybrid Electric Vehicles

3 Description

The ISO7830x device is a high-performance, 3-

channel digital isolator with 8000-VPK isolation

voltage. This device has reinforced isolation

certifications according to VDE, CSA, TUV and CQC.

The isolator provides high electromagnetic immunity

and low emissions at low power consumption, while

isolating CMOS or LVCMOS digital I/Os.

GNDI

GNDO

VCCI and GNDI are supply and ground

connections respectively for the input

channels.

VCCO and GNDO are supply and ground

connections respectively for the output

channels.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

etcTI

ISO7830 Datasheet Preview

ISO7830 Datasheet

Triple Digital Isolators

No Preview Available !

ISO7830, ISO7830F

SLLSEO2B – JULY 2015 – REVISED JUNE 2016

www.ti.com

Table of Contents

1 Features .................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions ......................... 4

6 Specifications......................................................... 5

6.1 Absolute Maximum Ratings ...................................... 5

6.2 ESD Ratings.............................................................. 5

6.3 Recommended Operating Conditions....................... 5

6.4 Thermal Information .................................................. 6

6.5 Power Rating............................................................. 6

6.6 Insulation Characteristics .......................................... 7

6.7 Regulatory Information.............................................. 8

6.8 Safety Limiting Values .............................................. 8

6.9 Electrical Characteristics—5-V Supply ..................... 9

6.10 Supply Current Characteristics—5-V Supply .......... 9

6.11 Electrical Characteristics—3.3-V Supply .............. 10

6.12 Supply Current Characteristics—3.3-V Supply ..... 10

6.13 Electrical Characteristics—2.5-V Supply .............. 11

6.14 Supply Current Characteristics—2.5-V Supply ..... 11

6.15 Switching Characteristics—5-V Supply................. 12

6.16 Switching Characteristics—3.3-V Supply.............. 12

6.17 Switching Characteristics—2.5-V Supply.............. 13

6.18 Insulation Characteristics Curves ......................... 14

6.19 Typical Characteristics .......................................... 15

7 Parameter Measurement Information ................ 16

8 Detailed Description ............................................ 18

8.1 Overview ................................................................. 18

8.2 Functional Block Diagram ....................................... 18

8.3 Feature Description................................................. 19

8.4 Device Functional Modes........................................ 20

9 Application and Implementation ........................ 21

9.1 Application Information............................................ 21

9.2 Typical Application .................................................. 21

10 Power Supply Recommendations ..................... 23

11 Layout................................................................... 24

11.1 Layout Guidelines ................................................. 24

11.2 Layout Example .................................................... 24

12 Device and Documentation Support ................. 25

12.1 Documentation Support ........................................ 25

12.2 Related Links ........................................................ 25

12.3 Receiving Notification of Documentation Updates 25

12.4 Community Resources.......................................... 25

12.5 Trademarks ........................................................... 25

12.6 Electrostatic Discharge Caution ............................ 25

12.7 Glossary ................................................................ 25

13 Mechanical, Packaging, and Orderable

Information ........................................................... 26

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (September 2015) to Revision B

Page

• Changed Features From: Low Power Consumption, Typical 2.4 mA per Channel at 1 Mbps To: Low Power

Consumption, Typical 1.6 mA per Channel at 1 Mbps .......................................................................................................... 1

• Changed the isolation barrier life from > 25 years to > 40 years in the Features section ..................................................... 1

• Changed Features From: Safety and Regulatory Approvals To: Safety-Related Certifications ........................................... 1

• Updated the status of the certifications throughout the document ........................................................................................ 1

• Added the extra-wide body package (16 pin SOIC [DWW]) option........................................................................................ 1

• Deleted EN1 from the pin out drawing in the Pin Configuration and Functions section. Replaced references of ENx

with EN2 ................................................................................................................................................................................. 4

• Changed pin VCC1 description From: Power supply, VCC1 To: Power supply, side 1 in the PIN Functions table................... 4

• Changed pin VCC2 description From: Power supply, VCC2 To: Power supply, side 2 in the PIN Functions table................... 4

• Moved Junction temperature From Recommended Operating Conditions To Absolute Maximum Ratings .......................... 5

• Changed the values for the DW package in the Thermal Information table ......................................................................... 6

• Changed the maximum power dissipation values for side 1 (40 to 25) and side 2 (110 to 125) in the Power Rating table . 6

• Moved Insulation Characteristics to the Specifications section.............................................................................................. 7

• Changed CIO Specification From: 2 pF To: ~1 pF ................................................................................................................. 7

• Added the climatic category parameter to the Insulation Characteristics table .................................................................... 7

• Moved Regulatory Information to the Specifications section.................................................................................................. 8

• Moved Safety Limiting Values to the Specifications section .................................................................................................. 8

• Changed the test conditions and values for the DW package in the Safety Limiting Values table........................................ 8

• Changed VCCO to VCCI in the minimum value for the input threshold voltage hysteresis parameter in the electrical

characteristics tables .............................................................................................................................................................. 9

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