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LM15851 Datasheet Preview

LM15851 Datasheet

Ultra-Wideband RF Sampling Subsystem

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LM15851
SLAS990E – JANUARY 2014 – REVISED OCTOBER 2017
LM15851 Ultra-Wideband RF Sampling Subsystem
1 Features
1 Excellent Noise and Linearity up to and beyond
FIN = 3 GHz
• Configurable DDC
• Decimation Factors from 4 to 32 (Complex
Baseband Out)
• Usable Output Bandwidth of 800 MHz at
4x Decimation and 4000 MSPS
• Usable Output Bandwidth of 100 MHz at
32x Decimation and 4000 MSPS
• Low Pin-Count JESD204B Subclass 1 Interface
• Automatically Optimized Output Lane Count
• Embedded Low Latency Signal Range Indication
• Low Power Consumption
Key Specifications:
– Max Sampling Rate: 4000 MSPS
– Min Sampling Rate: 1000 MSPS
– DDC Output Word Size: 15-Bit Complex (30
bits total)
– IMD3: 64 dBc (FIN = 2140 MHz ± 30 MHz at
13 dBFS)
– FPBW (–3 dB): 3.2 GHz
– Supply Voltages: 1.9 V and 1.2 V
– Power Consumption
– Decimate by 10 (4000 MSPS): 2 W
– Power Down Mode: <50 mW
2 Applications
• Wireless Infrastructure
• RF-Sampling Software Defined Radio
• Wideband Microwave Backhaul
• DOCSIS / Cable Infrastructure
3 Description
The LM15851 device is a wideband sampling and
digital tuning device. Texas Instruments' giga-sample
analog-to-digital converter (ADC) technology enables
a large block of frequency spectrum to be sampled
directly at RF. An integrated DDC (Digital Down
Converter) provides digital filtering and down-
conversion. The selected frequency block is made
available on a JESD204B serial interface. Data is
output as baseband 15-bit complex information for
ease of downstream processing. Based on the digital
down-converter (DDC) decimation and link output
rate settings, this data is output on 1 to 5 lanes of the
serial interface.
The LM15851 device is available in a 68-pin VQFN
package. The device operates over the Industrial
(–40°C TA 85°C) ambient temperature range.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LM15851
VQFN (68)
10.00 mm × 10.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Decimate by 16 — Spectral Response
ƒS = 4 GHz, FIN = 1897 MHz at –1 dBFS, ƒ(NCO_x) = 1827 MHz
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
0
20
40
60
80
100
Frequency (MHz)
120
C002
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.




etcTI

LM15851 Datasheet Preview

LM15851 Datasheet

Ultra-Wideband RF Sampling Subsystem

No Preview Available !

LM15851
SLAS990E – JANUARY 2014 – REVISED OCTOBER 2017
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 9
6.1 Absolute Maximum Ratings ...................................... 9
6.2 ESD Ratings.............................................................. 9
6.3 Recommended Operating Conditions..................... 10
6.4 Thermal Information ................................................ 10
6.5 Electrical Characteristics......................................... 10
6.6 Timing Requirements .............................................. 14
6.7 Internal Characteristics ........................................... 16
6.8 Switching Characteristics ........................................ 17
6.9 Typical Characteristics ............................................ 19
7 Detailed Description ............................................ 24
7.1 Overview ................................................................. 24
7.2 Functional Block Diagram ....................................... 24
7.3 Feature Description................................................. 25
7.4 Device Functional Modes........................................ 43
7.5 Programming........................................................... 46
7.6 Register Map........................................................... 48
8 Application and Implementation ........................ 73
8.1 Application Information............................................ 73
8.2 Typical Application ................................................. 73
8.3 Initialization Set-Up ................................................. 75
8.4 Dos and Don'ts........................................................ 75
9 Power Supply Recommendations...................... 76
9.1 Supply Voltage ........................................................ 76
10 Layout................................................................... 77
10.1 Layout Guidelines ................................................. 77
10.2 Layout Example .................................................... 77
10.3 Thermal Management ........................................... 80
11 Device and Documentation Support ................. 80
11.1 Device Support...................................................... 80
11.2 Documentation Support ........................................ 82
11.3 Community Resource............................................ 82
11.4 Trademarks ........................................................... 82
11.5 Electrostatic Discharge Caution ............................ 82
11.6 Glossary ................................................................ 82
12 Mechanical, Packaging, and Orderable
Information ........................................................... 82
4 Revision History
Changes from Revision D (July 2015) to Revision E
Page
• Changed reset value of address 0x006 from 0x03 to 0x13 in Memory Map table............................................................... 48
• Changed reset value of address 0x006 from 0x03 to 0x13 in Standard SPI-3.0 Registers table........................................ 51
• Changed 0x03 to 0x13 in reset value and description of bits 7-0 and changed 0000 0011 to 0001 0011 in Chip
Version Register section....................................................................................................................................................... 52
Changes from Revision C (September 2014) to Revision D
Page
• Deleted references to time stamp including pin names (TMST+, TMST–). .......................................................................... 7
• Added additional voltage difference parameters to the Absolute Maximum Ratings table .................................................... 9
• Added junction temperature to the Absolute Maximum Ratings table ................................................................................... 9
• Added common mode voltage parameter to the Recommended Operating Conditions table. Changed CLK to
SYSREF, and ~SYNC ......................................................................................................................................................... 10
• Deleted the Differential Analog Input Connection image in The Analog Inputs section ...................................................... 25
• Added note about offset adjust in Background Calibration Mode to the Offset Adjust section and I/O offset register
tables .................................................................................................................................................................................... 29
• Added the Calibration Cycle Timing for Different Calibration Modes and Options table in the Timing Calibration
Mode section ........................................................................................................................................................................ 44
• Changed 0x004-0x005 to RESERVED in the Standard SPI-3.0 Registers summary table................................................. 51
• Changed the name of bit 0 in the Clock Generator Control 0 Register from DC_LVPECL_TS_EN to
DC_LVPECL_SYNC_en ...................................................................................................................................................... 56
Changes from Revision B (February 2014) to Revision C
Page
• Changed the device status from Product Preview to Production Data .................................................................................. 1
2
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Copyright © 2014–2017, Texas Instruments Incorporated



Part Number LM15851
Description Ultra-Wideband RF Sampling Subsystem
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