LM3410, LM3410-Q1
SNVS541H – OCTOBER 2007 – REVISED AUGUST 2016
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 6
7 Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 10
8 Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Applications ................................................ 19
9 Power Supply Recommendations...................... 31
10 Layout................................................................... 32
10.1 Layout Guidelines ................................................. 32
10.2 Layout Examples................................................... 32
10.3 Thermal Considerations ........................................ 33
11 Device and Documentation Support ................. 40
11.1 Device Support...................................................... 40
11.2 Documentation Support ........................................ 41
11.3 Related Links ........................................................ 41
11.4 Receiving Notification of Documentation Updates 41
11.5 Community Resources.......................................... 41
11.6 Trademarks ........................................................... 41
11.7 Electrostatic Discharge Caution ............................ 41
11.8 Glossary ................................................................ 41
12 Mechanical, Packaging, and Orderable
Information ........................................................... 42
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (April 2013) to Revision H
Page
• Added Device Information table, ESD Ratings table, Thermal Information table, Detailed Description section,
Feature Description section, Device Functional Modes section, Application and Implementation section, Typical
Application section, Power Supply Recommendations section, Layout section, Device and Documentation Support
section, and Mechanical, Packaging, and Orderable Information section.............................................................................. 1
• Added AEC-Q100 Test Guidance bullets to Features............................................................................................................ 1
• Changed RθJA value for NGG package from 80°C/W : to 55.3°C/W ...................................................................................... 4
• Changed RθJA value for DGN package from 80°C/W : to 53.7°C/W ...................................................................................... 4
• Changed RθJA value for DBV package from 118°C/W : to 164.2°C/W ................................................................................... 4
• Changed RθJC(top) value for NGG package from 18°C/W : to 65.9°C/W ................................................................................. 4
• Changed RθJC(top) value for DGN package from 18°C/W : to 61.4°C/W ................................................................................. 4
• Changed RθJC(top) value for DBV package from 60°C/W : to 115.3°C/W ................................................................................ 4
Changes from Revision F (May 2013) to Revision G
Page
• Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1
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