LM3671, LM3671-Q1
SNVS294S – NOVEMBER 2004 – REVISED MAY 2016
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings: LM3671 .............................................. 4
6.3 ESD Ratings: LM3671-Q1 ........................................ 4
6.4 Recommended Operating Conditions....................... 5
6.5 Thermal Information .................................................. 5
6.6 Dissipation Ratings ................................................... 5
6.7 Electrical Characteristics........................................... 6
6.8 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 13
8 Application and Implementation ........................ 16
8.1 Application Information............................................ 16
8.2 Typical Application .................................................. 16
9 Power Supply Recommendations...................... 20
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 22
10.3 DSBGA Package Assembly and Use ................... 22
11 Device and Documentation Support ................. 23
11.1 Device Support...................................................... 23
11.2 Documentation Support ........................................ 23
11.3 Related Links ........................................................ 23
11.4 Community Resources.......................................... 23
11.5 Trademarks ........................................................... 23
11.6 Electrostatic Discharge Caution ............................ 23
11.7 Glossary ................................................................ 23
12 Mechanical, Packaging, and Orderable
Information ........................................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision R (November 2014) to Revision S
Page
• Added top nav icon for TI Design .......................................................................................................................................... 1
• Added several new "Applications" ......................................................................................................................................... 1
• moved storage temperature to Abs Max table ...................................................................................................................... 4
• Changed Handling Ratings to ESD Ratings .......................................................................................................................... 4
• Changed RθJA for USON from 165°C/W to 174.7°C/W; for SOT-23 from 130°C/W to 165.7°C/W, and for DSBGA
from 85°C/W to 181.0°C/W; added additional thermal values ............................................................................................... 5
• Changed RθJA values in Dissipation Ratings table ................................................................................................................. 5
Changes from Revision Q (November 2013) to Revision R
Page
• Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application
and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section ............. 1
Changes from Revision O (April 2013) to Revision P
Page
• Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 22
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Product Folder Links: LM3671 LM3671-Q1
