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MSP430FR2422 Datasheet Preview

MSP430FR2422 Datasheet

Mixed-Signal Microcontrollers

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MSP430FR2422
SLASEE5B – JANUARY 2018 – REVISED AUGUST 2019
MSP430FR2422 Mixed-Signal Microcontroller
1 Device Overview
1.1 Features
1
• Embedded microcontroller
– 16-bit RISC architecture
– Clock supports frequencies up to 16 MHz
– Wide supply voltage range from 3.6 V down to
1.8 V (minimum supply voltage is restricted by
SVS levels, see the SVS Specifications)
• Optimized ultra-low-power modes
– Active mode: 120 µA/MHz (typical)
– Standby: LPM3.5, real-time clock (RTC) counter
with 32768-Hz crystal: 710 nA (typical)
– Shutdown (LPM4.5): 36 nA without SVS
• Low-power ferroelectric RAM (FRAM)
– Up to 7.5 KB of nonvolatile memory
– Built-in error correction code (ECC)
– Configurable write protection
– Unified memory of program, constants, and
storage
– 1015 write cycle endurance
– Radiation resistant and nonmagnetic
– High FRAM-to-SRAM ratio, up to 4:1
• High-performance analog
– Up to 8-channel 10-bit analog-to-digital
converter (ADC)
– Internal 1.5-V reference
– Sample-and-hold 200 ksps
• Intelligent digital peripherals
– Two 16-bit timers with three capture/compare
registers each (Timer_A3)
– One 16-bit counter-only RTC
– 16-bit cyclic redundancy check (CRC)
• Enhanced serial communications with support for
pin remap feature (see Device Comparison)
– One eUSCI_A supports UART, IrDA, and SPI
– One eUSCI_B supports SPI and I2C
• Clock system (CS)
– on-chip 32-kHz RC oscillator (REFO)
– on-chip 16-MHz digitally controlled oscillator
(DCO) with frequency-locked loop (FLL)
– ±1% accuracy with on-chip reference at room
temperature
– On-chip very low-frequency 10-kHz oscillator
(VLO)
– On-chip high-frequency modulation oscillator
(MODOSC)
– External 32-kHz crystal oscillator (LFXT)
– Programmable MCLK prescalar of 1 to 128
– SMCLK derived from MCLK with programmable
prescalar of 1, 2, 4, or 8
• General input/output and pin functionality
– Total of 15 I/Os on VQFN-20 package
– 15 interrupt pins (P1 and P2) can wake MCU
from low-power modes
• Development tools and software
– Development tools
– Target development board
MSPTS430RHL20
• Family Members (Also See Device Characteristics)
– MSP430FR2422: 7.25KB of program FRAM,
256B of information FRAM, 2KB of RAM
• Package options
– 20-pin: VQFN (RHL)
– 16-pin: TSSOP (PW)
1.2 Applications
• Industrial sensors
• Battery packs
• Portable appliances
• Electric toothbrushes
• Low-power medical, health, and fitness
1.3 Description
MSP430FR2422 is part of the MSP430™ value line microcontroller (MCU) portfolio, TI’s lowest cost family
of MCUs for sensing and measurement applications. The MSP430FR2422 MCU provides 8KB of
nonvolatile memory with an 8-channel 10-bit ADC. The architecture, FRAM, and integrated peripherals,
combined with extensive low-power modes, are optimized to achieve extended battery life in portable and
battery-powered sensing applications. Available in a 16-pin TSSOP or a 20-pin VQFN package.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.




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MSP430FR2422 Datasheet Preview

MSP430FR2422 Datasheet

Mixed-Signal Microcontrollers

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MSP430FR2422
SLASEE5B – JANUARY 2018 – REVISED AUGUST 2019
www.ti.com
TI's MSP430 ultra-low-power FRAM microcontroller platform combines uniquely embedded FRAM and a
holistic ultra-low-power system architecture, allowing system designers to increase performance while
lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and
endurance of RAM with the nonvolatility of flash.
The MSP430FR2422 MCU is supported by an extensive hardware and software ecosystem with reference
designs and code examples to get your design started quickly. Development kits include the MSP-
TS430RHL20 20-pin target development board. TI also provides free MSP430Ware™ software, which is
available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource
Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online
support through the E2E™ support forums.
For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User's Guide.
PART NUMBER
Device Information(1)
PACKAGE
BODY SIZE(2)
MSP430FR2422IPW16
TSSOP (16)
5 mm × 4.4 mm
MSP430FR2422IRHL
VQFN (20)
4.5 mm × 3.5 mm
(1) For the most current part, package, and ordering information, see the Package Option Addendum in
Section 9, or see the TI website at www.ti.com.
(2) The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 9.
CAUTION
System-level ESD protection must be applied in compliance with the device-
level ESD specification to prevent electrical overstress or disturbing of data or
code memory. See MSP430 System-Level ESD Considerations for more
information.
2 Device Overview
Copyright © 2018–2019, Texas Instruments Incorporated
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Part Number MSP430FR2422
Description Mixed-Signal Microcontrollers
Maker etcTI
Total Page 30 Pages
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