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MSP430FR2433 Datasheet Preview

MSP430FR2433 Datasheet

Mixed-Signal Microcontrollers

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MSP430FR2433
SLASE59E – OCTOBER 2015 – REVISED AUGUST 2019
MSP430FR2433 Mixed-Signal Microcontroller
1 Device Overview
1.1 Features
1
• Embedded microcontroller
– 16-bit RISC architecture
– Clock supports frequencies up to 16 MHz
– Wide supply voltage range from 3.6 V down to
1.8 V (minimum supply voltage is restricted by
SVS levels, see the SVS specifications)
• Optimized ultra-low-power modes
– Active mode: 126 µA/MHz (typical)
– Standby: <1 µA with VLO
– LPM3.5 real-time clock (RTC) counter with
32768-Hz crystal: 730 nA (typical)
– Shutdown (LPM4.5): 16 nA (typical)
• High-performance analog
– 8-channel 10-bit analog-to-digital converter
(ADC)
– Internal 1.5-V reference
– Sample-and-hold 200 ksps
• Enhanced serial communications
– Two enhanced universal serial communication
interfaces (eUSCI_A) support UART, IrDA, and
SPI
– One eUSCI (eUSCI_B) supports SPI and I2C
• Intelligent digital peripherals
– Four 16-bit timers
– Two timers with three capture/compare
registers each (Timer_A3)
– Two timers with two capture/compare
registers each (Timer_A2)
– One 16-bit counter-only RTC
– 16-bit cyclic redundancy check (CRC)
• Low-power ferroelectric RAM (FRAM)
– Up to 15.5KB of nonvolatile memory
– Built-in error correction code (ECC)
– Configurable write protection
– Unified memory of program, constants, and
storage
– 1015 write cycle endurance
– Radiation resistant and nonmagnetic
– High FRAM-to-SRAM ratio, up to 4:1
• Clock system (CS)
– On-chip 32-kHz RC oscillator (REFO)
– On-chip 16-MHz digitally controlled oscillator
(DCO) with frequency-locked loop (FLL)
– ±1% accuracy with on-chip reference at room
temperature
– On-chip very low-frequency 10-kHz oscillator
(VLO)
– On-chip high-frequency modulation oscillator
(MODOSC)
– External 32-kHz crystal oscillator (LFXT)
– Programmable MCLK prescalar of 1 to 128
– SMCLK derived from MCLK with programmable
prescalar of 1, 2, 4, or 8
• General input/output and pin functionality
– Total of 19 I/Os on VQFN-24 package
– 16 interrupt pins (P1 and P2) can wake MCU
from low-power modes
• Development tools and software
– Development tools
– LaunchPad™ development kit
(MSPEXP430FR2433)
– Target development board
(MSPTS430RGE24A)
• Family member (also see Device Comparison)
– MSP430FR2433: 15KB of program FRAM, 512B
of information FRAM, 4KB of RAM
• Package options
– 24 pin: VQFN (RGE)
– 24-pin: DSBGA (YQW)
1.2 Applications
• Small form factor industrial sensors
• Low-power medical, health, and fitness
• Electronic door locks
• Energy harvesting
1.3 Description
The MSP430FR2433 microcontroller (MCU) is part of the MSP430™ Value Line sensing portfolio, TI's
lowest-cost family of MCUs for sensing and measurement applications. The architecture, FRAM, and
integrated peripherals, combined with extensive low-power modes, are optimized to achieve extended
battery life in portable and battery-powered sensing applications in a small VQFN package
(4 mm × 4 mm).
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.




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MSP430FR2433 Datasheet Preview

MSP430FR2433 Datasheet

Mixed-Signal Microcontrollers

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MSP430FR2433
SLASE59E – OCTOBER 2015 – REVISED AUGUST 2019
www.ti.com
TI's MSP430 ultra-low-power FRAM microcontroller platform combines uniquely embedded FRAM and a
holistic ultra-low-power system architecture, allowing system designers to increase performance while
lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and
endurance of RAM with the nonvolatility of flash.
The MSP430FR2433 MCU is supported by an extensive hardware and software ecosystem with reference
designs and code examples to get your design started quickly. Development kits include the
MSPEXP430FR2433 LaunchPad™ development kit and the MSPTS430RGE24A 24-pin target
development board. TI also provides free MSP430Ware™ software, which is available as a component of
Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430
MCUs are also supported by extensive online collateral, training, and online support through the E2E™
support forums.
For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User's Guide.
PART NUMBER
Device Information(1)
PACKAGE
BODY SIZE(2)
MSP430FR2433IRGE
VQFN (24)
4 mm × 4 mm
MSP430FR2433IYQW
DSBGA (24)
2.29 mm × 2.34 mm
(1) For the most current part, package, and ordering information, see the Package Option Addendum in
Section 9, or see the TI website at www.ti.com.
(2) The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 9.
CAUTION
System-level ESD protection must be applied in compliance with the device-
level ESD specification to prevent electrical overstress or disturbing of data or
code memory. See MSP430 System-Level ESD Considerations for more
information.
2 Device Overview
Copyright © 2015–2019, Texas Instruments Incorporated
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Product Folder Links: MSP430FR2433


Part Number MSP430FR2433
Description Mixed-Signal Microcontrollers
Maker etcTI
Total Page 30 Pages
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