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OPA49PW Datasheet Preview

OPA49PW Datasheet

Low-Power OpAmp

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OPA990, OPA2990, OPA4990
SBOS933F – FEBRUARY 2019 – REVISED MAY 2020
OPAx990 40-V Rail-to-Rail Input/Output, Low Offset Voltage, Low Power Op Amp
1 Features
1 Low offset voltage: ±300 µV
• Low offset voltage drift: ±0.6 µV/°C
• Low noise: 30 nV/Hz at 1 kHz
• High common-mode rejection: 115 dB
• Low bias current: ±10 pA
• Rail-to-rail input and output
• MUX-friendly/comparator inputs
– Amplifier operates with differential inputs up to
supply rail
– Amplifier can be used in open-loop or as
comparator
• Wide bandwidth: 1.1-MHz GBW
• High slew rate: 4.5 V/µs
• Low quiescent current: 120 µA per amplifier
• Wide supply: ±1.35 V to ±20 V, 2.7 V to 40 V
• Robust EMIRR performance: 78 dB at 1.8 GHz
• Differential and common-mode input voltage
range to supply rail
2 Applications
• Multiplexed data-acquisition systems
• Test and measurement equipment
• Motor drive: power stage and control modules
• Power delivery: UPS, server, and merchant
network power
• ADC driver and reference buffer amplifier
• Programmable logic controllers
• Analog input and output modules
• High-side and low-side current sensing
• High precision comparator
3 Description
The OPAx990 family (OPA990, OPA2990, and
OPA4990) is a family of high voltage (40-V) general
purpose operational amplifiers. These devices offer
excellent DC precision and AC performance,
including rail-to-rail input/output, low offset (±300 µV,
typ), and low offset drift (±0.6 µV/°C, typ).
Unique features such as differential and common-
mode input voltage range to the supply rail, high
short-circuit current (±80 mA), high slew rate (4.5
V/µs), and shutdown make the OPAx990 an
extremely flexible, robust, and high-performance op
amp for high-voltage industrial applications.
The OPAx990 family of op amps is available in micro-
size packages (such as X2QFN, WSON, and SOT-
553), as well as standard packages (such as SOT-23,
SOIC, and TSSOP), and is specified from –40°C to
125°C.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SOT-23 (5)
2.90 mm × 1.60 mm
OPA990
SOT-23 (6)
SC70 (5)
SOT-553 (5)(2)
2.90 mm × 1.60 mm
2.00 mm × 1.25 mm
1.60 mm × 1.20 mm
SOIC (8)
SOT-23 (8)(2)
4.90 mm × 3.90 mm
2.90 mm × 1.60 mm
OPA2990
TSSOP (8)
VSSOP (8)(2)
3.00 mm × 4.40 mm
3.00 mm × 3.00 mm
WSON (8)
2.00 mm × 2.00 mm
X2QFN (10)
2.00 mm × 1.50 mm
SOIC (14)
8.65 mm × 3.90 mm
OPA4990
TSSOP (14)
WQFN (16)(2)
X2QFN (14)(2)
5.00 mm × 4.40 mm
3.00 mm × 3.00 mm
2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) This package is preview only.
OPAx990 in a High-Voltage, Multiplexed, Data-Acquisition System
Analog Inputs
Bridge Sensor
Thermocouple
Current Sensing
MUX509
OPA990
+
+
OPA990
Gain Network
Gain Network
Gain Network
OPA990
+
REF3140
RC Filter OPA375
Reference Driver
RC Filter
Antialiasing
Filter
VINP
REF
ADS8860
VINM
Photo
LED Detector
Optical Sensor
High-Voltage Multiplexed Input
High-Voltage Level Translation
VCM
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.




etcTI

OPA49PW Datasheet Preview

OPA49PW Datasheet

Low-Power OpAmp

No Preview Available !

OPA990, OPA2990, OPA4990
SBOS933F – FEBRUARY 2019 – REVISED MAY 2020
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications....................................................... 10
6.1 Absolute Maximum Ratings .................................... 10
6.2 ESD Ratings............................................................ 10
6.3 Recommended Operating Conditions..................... 10
6.4 Thermal Information for Single Channel ................. 10
6.5 Thermal Information for Dual Channel.................... 11
6.6 Thermal Information for Quad Channel .................. 11
6.7 Electrical Characteristics......................................... 12
6.8 Typical Characteristics ............................................ 15
7 Detailed Description ............................................ 23
7.1 Overview ................................................................. 23
7.2 Functional Block Diagram ....................................... 23
7.3 Feature Description................................................. 24
7.4 Device Functional Modes........................................ 31
8 Application and Implementation ........................ 32
8.1 Application Information............................................ 32
8.2 Typical Applications ................................................ 32
9 Power Supply Recommendations...................... 34
10 Layout................................................................... 34
10.1 Layout Guidelines ................................................. 34
10.2 Layout Example .................................................... 34
11 Device and Documentation Support ................. 37
11.1 Device Support...................................................... 37
11.2 Documentation Support ........................................ 37
11.3 Related Links ........................................................ 37
11.4 Receiving Notification of Documentation Updates 38
11.5 Support Resources ............................................... 38
11.6 Trademarks ........................................................... 38
11.7 Electrostatic Discharge Caution ............................ 38
11.8 Glossary ................................................................ 38
12 Mechanical, Packaging, and Orderable
Information ........................................................... 38
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (December 2019) to Revision F
Page
• Removed preview notation from OPA2990 X2QFN (10) package from Device Information table ........................................ 1
• Removed preview notation from OPA2990S RUG package (X2QFN) in the Pin Configuration and Functions section ....... 6
• Changed RUG (X2QFN) in Thermal Information for Dual Channel section......................................................................... 10
Changes from Revision D (July 2019) to Revision E
Page
• Changed the OPA990 and OPA4990 device statuses from Advance Information to Production Data ................................. 1
• Removed preview notation from OPA990 SOT-23 (5) package from Device Information table ............................................ 1
• Removed preview notation from OPA990S SOT-23 (6) package from Device Information table.......................................... 1
• Removed preview notation from OPA990 SC70 (5) package from Device Information table................................................ 1
• Removed preview notation from OPA4990 SOIC (14) package from Device Information table............................................ 1
• Removed preview notation from OPA4990 TSSOP (14) package from Device Information table ........................................ 1
• Removed preview notation from OPA990 DBV package (SOT-23) in the Pin Configuration and Functions section ............ 4
• Removed preview notation from OPA990 DCK package (SC70) in the Pin Configuration and Functions section ............... 4
• Removed preview notation from OPA990S DBV package (SOT-23) in the Pin Configuration and Functions section.......... 4
• Removed preview notation from OPA4990 D (SOIC) and TSSOP (PW) packages in the Pin Configuration and
Functions section.................................................................................................................................................................... 7
Changes from Revision C (May 2019) to Revision D
Page
• Removed preview notation from OPA2990 WSON (8) package from Device Information table ........................................... 1
• Removed preview notation from OPA2990 DSG package (WSON) in the Pin Configuration and Functions section ........... 5
• Added SHUTDOWN to Electrical Characteristics table........................................................................................................ 13
• Added Shutdown section to the Detailed Description section .............................................................................................. 31
2
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Copyright © 2019–2020, Texas Instruments Incorporated
Product Folder Links: OPA990 OPA2990 OPA4990


Part Number OPA49PW
Description Low-Power OpAmp
Maker etcTI
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