... 11 1.1 SUPPORTS EXTREME TEMPERATURE APPLICATIONS ....... 12
2 Introduction ........ 13 2.1 Description ... 13 2.2 Device Summary ...... 13 2.3 Die Layout .... 14 2.4 .
....... 12
2 Introduction ........ 13 2.1 Description ... 13 2.2 Device Summary ...... 13 2.3 Die Layout .... 14 2.4 Pin.
... 13 2.2 Device Summary ...... 13 2.3 Die Layout .... 14 2.4 Pin Assignments ....... 15 2.5 Signal Descriptions .... 16
3 Functional Overview ...... 25 3.1 Memory Map . 26 3.2 Brief Descriptions ...... 29 3.2.1 C28x CPU ... 29 3.2.2 Memory Bus (Har.
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