Overview: SN54ABT823, SN74ABT823
9-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS
SCBS158E – JANUARY 1991 – REVISED MAY 1997 D State-of-the-Art EPIC-ΙΙB™ BiCMOS Design
Significantly Reduces Power Dissipation
D ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D Typical VOLP (Output Ground Bounce) < 1 V
at VCC = 5 V, TA = 25°C
D High-Impedance State During Power Up
and Power Down
D High-Drive Outputs (–32-mA IOH, 64-mA IOL) D Buffered Control Inputs to Reduce
dc Loading Effects
D Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic Chip
Carriers (FK) and Flatpacks (W), and
Standard Plastic (NT) and Ceramic (JT)
DIPs 2D 1D OE NC SN54ABT823 . . . JT OR W PACKAGE SN74ABT823 . . . DB, DW, OR NT PACKAGE
(TOP VIEW) OE 1 1D 2 2D 3 3D 4 4D 5 5D 6 6D 7 7D 8 8D 9 9D 10 CLR 11 GND 12 24 VCC 23 1Q 22 2Q 21 3Q 20 4Q 19 5Q 18 6Q 17 7Q 16 8Q 15 9Q 14 CLKEN 13 CLK SN54ABT823 . . .
