Datasheet4U Logo Datasheet4U.com

SN74AHCT16244 - 16-Bit Buffers/Drivers

Description

The SN74AHCT16244 device is a 16-bit buffer and line driver specifically designed to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

Features

  • 1 Members of the Texas Instruments Widebus™ Family.
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process.
  • Inputs are TTL-Voltage Compatible.
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise.
  • Flow-Through Architecture Optimizes PCB Layout.
  • Latch-Up Performance Exceeds 250 mA Per JESD 17.
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015.
  • Package Options Include:.
  • Plastic Shrink Small Outline (.

📥 Download Datasheet

Datasheet preview – SN74AHCT16244

Datasheet Details

Part number SN74AHCT16244
Manufacturer Texas Instruments
File Size 594.49 KB
Description 16-Bit Buffers/Drivers
Datasheet download datasheet SN74AHCT16244 Datasheet
Additional preview pages of the SN74AHCT16244 datasheet.

📁 Similar Datasheet

  • SN74101 - AND-OR Gate (ETC)
  • SN74102 - AND Gate (ETC)
  • SN74103 - Dual J-K Flip-Flop (ETC)
  • SN74106 - Dual J-K Flip-Flop (ETC)
  • SN74108 - Dual J-K Flip Flop (ETC)
  • SN7411 - Triple 3-Input AND (ETC)
  • SN74120 - Dual Pulse Synchronizers / Drivers (Texas Instruments Inc)
  • SN74124 - Dual Voltage Controlled Oscillators (ETC)
  • SN7415 - Triple 3 Input AND Gate (Motorola)
  • SN74381 - integrated circuits (ETC)
Other Datasheets by Texas Instruments

Full PDF Text Transcription

Click to expand full text
Product Folder Sample & Buy Technical Documents Tools & Software Support & Community SN74AHCT16244 SCLS334J – MARCH 1996 – REVISED OCTOBER 2014 SN74AHCT16244 16-Bit Buffers/Drivers With 3-State Outputs 1 Features •1 Members of the Texas Instruments Widebus™ Family • EPIC™ (Enhanced-Performance Implanted CMOS) Process • Inputs are TTL-Voltage Compatible • Distributed VCC and GND Pins Minimize High-Speed Switching Noise • Flow-Through Architecture Optimizes PCB Layout • Latch-Up Performance Exceeds 250 mA Per JESD 17 • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015 • Package Options Include: – Plastic Shrink Small Outline (DL) Package – Thin Shrink Small Outline (DGG) Package – Thin Very Small Outline (DGV) Package – 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil
Published: |