• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
• Ioff Supports Partial-Power-Down Mode
• Sub-1-V Operable
• Max tpd of 2.5 ns at 1.8 V
SINGLE INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES372M – SEPTEMBER 2001 – REVISED FEBRUARY 2007
• Low Power Consumption, 10-µA Max ICC
• ±8-mA Output Drive at 1.8 V
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
This single inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to
1.95-V VCC operation.
The output of the SN74AUC1G06 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions.
–40 C to
ORDERABLE PART NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
Reel of 3000 SN74AUC1G06YZPR
SOT (SOT-23) – DBV
Reel of 3000 SN74AUC1G06DBVR
SOT (SC-70) – DCK
Reel of 3000 SN74AUC1G06DCKR
_ _ _UT_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated