TAS5414C-Q1, TAS5424C-Q1
SLOS795F – SEPTEMBER 2013 – REVISED OCTOBER 2017
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 6
6.1 Absolute Maximum Ratings ...................................... 6
6.2 ESD Ratings ............................................................ 6
6.3 Recommended Operating Conditions ...................... 7
6.4 Thermal Information .................................................. 7
6.5 Electrical Characteristics........................................... 8
6.6 Timing Requirements for I2C Interface Signals....... 11
6.7 Typical Characteristics ............................................ 12
7 Detailed Description ............................................ 14
7.1 Overview ................................................................. 14
7.2 Functional Block Diagram ....................................... 14
7.3 Feature Descption................................................... 15
7.4 Device Functional Modes........................................ 21
7.5 Programming........................................................... 25
7.6 Register Maps ......................................................... 27
8 Application and Implementation ........................ 32
8.1 Application Information............................................ 32
8.2 Typical Application .................................................. 32
9 Power Supply Recommendations...................... 35
10 Layout................................................................... 36
10.1 Layout Guidelines ................................................. 36
10.2 Layout Example .................................................... 36
10.3 Thermal Consideration.......................................... 39
10.4 Electrical Connection of Heat Slug and Heat
Sink .......................................................................... 40
10.5 EMI Considerations............................................... 40
11 Device and Documentation Support ................. 41
11.1 Device Support...................................................... 41
11.2 Related Links ........................................................ 41
11.3 Trademarks ........................................................... 41
11.4 Electrostatic Discharge Caution ............................ 41
11.5 Glossary ................................................................ 41
12 Mechanical, Packaging, and Orderable
Information ........................................................... 41
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (January 2015) to Revision F
Page
• Changed the AEXC-Q100 Qualified Feature to include temperature and ESD classifications ............................................. 1
• Changed pin 33 From: CP_BOT To: CPC_BOT in the DKE package image ....................................................................... 4
• Changed pin 40 From: CP_BOT To: CPC_BOT in the PHD package image ....................................................................... 4
Changes from Revision D (September 2014) to Revision E
Page
• Deleted text from step 4 of the Hardware Controls Pins section - "..if, not a quick ramp-down...entering standby." ......... 20
• Added the Programming section for Read, Write information .............................................................................................. 25
• Added a NOTE to the Applications and Implementation section ......................................................................................... 32
• Added section title - Typical Application............................................................................................................................... 32
• Changed Thermal Information To Thermal Consideration and moved the section after Layout Example .......................... 39
Changes from Revision C (July 2013) to Revision D
Page
• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
• Added the Device Information table ....................................................................................................................................... 1
• Changed the Human body model (HBM) value From 3000 V To: ±2500 V .......................................................................... 6
• Added the Design Requirements section ............................................................................................................................. 33
• Added the Application Curves ............................................................................................................................................. 35
• Added the Layout section .................................................................................................................................................... 36
2
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