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THS4275 Datasheet Preview

THS4275 Datasheet

VOLTAGE FEEDBACK AMPLIFIER

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DGN-8 DGK-8 D-8
DRB-8
THS4271
THS4275
www.ti.com
SLOS397F – JULY 2002 – REVISED OCTOBER 2009
LOW NOISE, HIGH SLEW RATE, UNITY GAIN STABLE
VOLTAGE FEEDBACK AMPLIFIER
Check for Samples: THS4271 THS4275
FEATURES
1
23 Unity Gain Stability
• Low Voltage Noise
– 3 nV/Hz
• High Slew Rate: 1000 V/μs
• Low Distortion
– –92 dBc THD at 30 MHz
• Wide Bandwidth: 1.4 GHz
• Supply Voltages
– +5 V, ±5 V
• Power Down Functionality (THS4275)
• Evaluation Module Available
APPLICATIONS
• High Linearity ADC Preamplifier
• Wireless Communication Receivers
• Differential to Single-Ended Conversion
• DAC Output Buffer
• Active Filtering
Low-Noise, Low-Distortion, Wideband Application Circuit
50 Source
+5 V
50
+
VI
49.9 THS4271
VO
_
DESCRIPTION
The THS4271 and THS4275 are low-noise, high slew
rate, unity gain stable voltage-feedback amplifiers
designed to run from supply voltages as low as 5 V
and as high as ±5 V. The THS4275 offers the same
performance as the THS4271 with the addition of a
power-down capability. The combination of low-noise,
high slew rate, wide bandwidth, low distortion, and
unity gain stability make the THS4271 and THS4275
high performance devices across multiple ac
specifications.
Designers using the THS4271 are rewarded with
higher dynamic range over a wider frequency band
without the stability concerns of decompensated
amplifiers. The devices are available in SOIC, MSOP
with PowerPAD™, and leadless MSOP with
PowerPAD™ packages.
The THS4271 and THS4275 may have low-level
oscillation when the die temperature (also known as
the junction temperature) exceeds +60°C. For more
information, see Maximum Die Temperature to
Prevent Oscillation.
DEVICE
THS4211
THS4503
THS3202
RELATED DEVICES
DESCRIPTION
1-GHz voltage-feedback amplifier
Wideband, fully-differential amplifier
Dual, wideband current feedback amplifier
-5 V
249
249
NOTE: Power supply decoupling capacitors not shown
THS4271
NC
1
8
NC
IN−
2
7
VS+
IN+
3
6
VOUT
VS−
4
5
NC
HARMONIC AND INTERMODULATION
DISTORTION
vs
FREQUENCY
−40
Gain = 2
Rf = 249
−50 RL = 150
VO = 2 VPP
−60 VS = ±5 V
IMD3
200 kHz Tone Spacing
−70
VO = 2 VPP Envelope
−80
HD2
−90
HD3
−100
1
10
100
f − Frequency − MHz
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
2
All other trademarks are the property of their respective owners.
3
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2009, Texas Instruments Incorporated




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THS4275 Datasheet Preview

THS4275 Datasheet

VOLTAGE FEEDBACK AMPLIFIER

No Preview Available !

THS4271
THS4275
SLOS397F – JULY 2002 – REVISED OCTOBER 2009
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PLASTIC
SMALL OUTLINE (D) (2)
THS4271D
THS4271DR
THS4275D
THS4275DR
PACKAGING/ORDERING INFORMATION(1)
LEADLESS
MSOP 8 (3)
ORDERABLE PACKAGE AND NUMBER
PLASTIC MSOP (2)
PowerPAD
PLASTIC MSOP (2)
(DRB)
(DGN)
PACKAGE MARKING
(DGK)
PACKAGE
MARKING
THS4271DRBT
THS4271DRBR
THS4271DGN
THS4271DGNR
BFQ
THS4271DGK
THS4271DGKR
BEY
THS4275DRBT
THS4275DRBR
THS4275DGN
THS4275DGNR
BFR
THS4275DGK
BJD
THS4275DGKR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) All packages are available taped and reeled. The R suffix standard quantity is 2500 (for example, THS4271DGNR).
(3) All packages are available taped and reeled. The R suffix standard quantity is 3000. The T suffix standard quantity is 250 (for example,
THS4271DRBT).
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range unless otherwise noted(1)
VS
VI
IO (2)
TJ
TJ (2)
TJ (3)
Tstg
Supply voltage
Input voltage
Output current
Continuous power dissipation
Maximum junction temperature
Maximum junction temperature, continuous operation long term reliability
Maximum junction temperature to prevent oscillation
Storage temperature range
HBM
ESD ratings CDM
MM
UNIT
16.5 V
±VS
100 mA
See Dissipation Ratings Table
+150°C
+125°C
+60°C
–65°C to +150°C
3000 V
1500 V
1000 V
(1) The absolute maximum temperature under any condition is limited by the constraints of the silicon process. Stresses above these
ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not
implied.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
(3) See Maximum Die Temperature to Prevent Oscillation section in the Application Information of this data sheet.
PACKAGE DISSIPATION RATINGS
PACKAGE
θJC
(°C/W)
D (8 pin)
DGN (8 pin)(2)
38.3
4.7
DGK (8 pin)
DRB (8 pin)(2)
54.2
5
θJA (1)
(°C/W)
97.5
58.4
260
45.8
(1) These data were taken using the JEDEC standard High-K test PCB.
(2) The THS4271/5 may incorporate a PowerPAD™ on the underside of the chip. This feature acts as a
heat sink and must be connected to a thermally dissipative plane for proper power dissipation. Failure
to do so may result in exceeding the maximum junction temperature which could permanently damage
the device. See TI technical briefs SLMA002 and SLMA004 for more information about utilizing the
PowerPAD thermally enhanced package.
2
Submit Documentation Feedback
Copyright © 2002–2009, Texas Instruments Incorporated
Product Folder Link(s): THS4271 THS4275


Part Number THS4275
Description VOLTAGE FEEDBACK AMPLIFIER
Maker etcTI
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