2.7ĆV TO 5.5ĆV LOWĆPOWER DUAL 12ĆBIT
DIGITALĆTOĆANALOG CONVERTER WITH POWER DOWN
SGLS214 − OCTOBER 2003
D Controlled Baseline
− One Assembly/Test Site, One Fabrication
D Extended Temperature Performance of
−55°C to 125°C
D Enhanced Diminishing Manufacturing
Sources (DMS) Support
D Enhanced Product-Change Notification
D Qualification Pedigree†
D Dual 12-Bit Voltage Output DAC
D Programmable Settling Time
− 3 µs in Fast Mode
− 10 µs in Slow Mode
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
D Compatible With TMS320 and SPI Serial
D Differential Nonlinearity <0.5 LSB Typ
D Monotonic Over Temperature
D Direct Replacement for TLC5618A
D Digital Servo Control Loops
D Digital Offset and Gain Adjustment
D Industrial Process Control
D Machine and Motion Control Devices
D Mass Storage Devices
The TLV5618A is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface is
compatible with TMS320, SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string
containing 4 control and 12 data bits.
The resistor string output voltage is buffered by an x2 gain rail-to-rail output buffer. The buffer features a
Class-AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC
allows the designer to optimize speed versus power dissipation.
Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It
is available in an 8-pin SOIC package.
The TLV5618AM is characterized for operation from − 55°C to 125°C.
−55°C to 125°C SOIC (D)
Tape and reel TLV5618AMDREP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI and QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corporation.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 2003 Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265