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TLV705 Datasheet

Low-Dropout Regulator

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TLV705, TLV705P
SBVS151F – DECEMBER 2010 – REVISED APRIL 2017
TLV705 200-mA, Low IQ, Low-Noise, Low-Dropout Regulator in Ultra-Small,
0.77-mm × 0.77-mm DSBGA and PicoStar™
1 Features
1 Very Low Dropout:
– 105 mV at IOUT = 150 mA
– 145 mV at IOUT = 200 mA
• Accuracy: 0.5% Typical
• Low IQ: 35 μA
• Available in Fixed-Output Voltages From
0.7 V to 4.8 V
• VIN Range: 2 V to 5.5 V
• High PSRR: 70 dB at 1 kHz
• Stable With Effective Capacitance of 0.1 μF
• Thermal Shutdown and Overcurrent Protection
• Available in an Ultra-Low Profile (0.15-mm
Maximum Height) PicoStar Package Option
2 Applications
• Wireless Handsets
• Smart Phones
• Zigbee® Networks
• Bluetooth® Devices
• Other Li-Ion Operated Handheld Products
• WLAN and Other PC Add-On Cards
3 Description
The TLV705 series of low-dropout (LDO) linear
regulators are low quiescent current devices with
excellent line and load transient performance. These
devices are designed for power-sensitive
applications, with a precision band gap. An error
amplifier provides typical accuracy of 0.5%. Low
output noise, very high power-supply rejection ratio
(PSRR), and low dropout voltage make this series of
LDOs ideal for a wide selection of battery-operated
handheld equipment. All devices have a thermal
shutdown and current limit for safety.
Furthermore, the TLV705 series is stable with an
effective output capacitance of only 0.1 μF. This
feature enables the use of cost-effective capacitors
that have higher bias voltage and temperature
derating. The devices regulate to the specified
accuracy with zero output load. The TLV705P series
also provides an active pulldown circuit to quickly
discharge output.
The TLV705 and TLV705P series are both available
in 0.77-mm × 0.77-mm DSBGA and PicoStar
packages with three height options that are optimal
for handheld applications.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TLV705
DSGBA (4)
PicoStar (4)
0.77 mm × 0.77 mm
0.77 mm × 0.77 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit (Fixed-Voltage Versions)
Input
CIN
On
Off
VIN
EN
TLV705
VOUT
COUT
Output
1 mF
Ceramic
GND
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.




etcTI

TLV705 Datasheet Preview

TLV705 Datasheet

Low-Dropout Regulator

No Preview Available !

TLV705, TLV705P
SBVS151F – DECEMBER 2010 – REVISED APRIL 2017
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ..................................... 5
6.2 ESD Ratings ............................................................ 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagrams ..................................... 12
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 14
8 Application and Implementation ........................ 15
8.1 Application Information............................................ 15
8.2 Typical Application .................................................. 15
8.3 Do's and Don'ts ....................................................... 16
9 Power Supply Recommendations...................... 16
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 17
10.3 Power Dissipation ................................................. 17
10.4 Power Dissipation and Junction Temperature ...... 17
10.5 Estimating Junction Temperature ......................... 18
11 Device and Documentation Support ................. 19
11.1 Device Support .................................................... 19
11.2 Documentation Support ....................................... 19
11.3 Related Links ........................................................ 19
11.4 Community Resources.......................................... 20
11.5 Trademarks ........................................................... 20
11.6 Electrostatic Discharge Caution ............................ 20
11.7 Glossary ................................................................ 20
12 Mechanical, Packaging, and Orderable
Information ........................................................... 20
12.1 Package Mounting ................................................ 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (May 2015) to Revision F
Page
• Deleted "x" from TLV705 device in document title ................................................................................................................ 1
• Changed package dimensions in document title from "0.8-mm × 0.8-mm" to "0.77-mm × 0.77-mm" .................................. 1
• Changed ultra-low profile maximum height from 0.2-mm to 0.15-mm in Applications section ............................................. 1
• Changed package dimensions in Description section from 0.8-mm to 0.77-mm. .................................................................. 1
• Changed DSBGA package dimensions from "0.80 mm × 0.80 mm" to "0.77 mm × 0.77 mm" in the Device
Information table .................................................................................................................................................................... 1
• Added copyright statement to the Typical Application Circuit ............................................................................................... 1
• Changed formatting of Thermal Information table note ......................................................................................................... 5
• Deleted "x" from device number in Thermal Information table .............................................................................................. 5
• Added copyright statement to functional block diagrams in Functional Block Diagrams section ........................................ 12
• Added copyright statement to Typical Application Circuit (Fixed-Voltage Versions) in the Typical Application section ..... 15
• Changed formatting of document reference in Related Documentation section ................................................................. 19
• Changed table header title from "Sample & Buy" to "Order Now" in the Related Links table ............................................ 19
Changes from Revision D (April 2015) to Revision E
Page
• Added new package (YFM) to document .............................................................................................................................. 1
• Added PicoStar to title ........................................................................................................................................................... 1
• Changed last Features bullet ................................................................................................................................................. 1
• Changed last sentence of Description section ...................................................................................................................... 1
• Added second row to Device Information table ..................................................................................................................... 1
• Added YFM pin out drawing ................................................................................................................................................... 4
• Added YFM package to Thermal Information table ............................................................................................................... 5
• Changed VO parameter units in Electrical Characteristics table: % for first row, mV for second row.................................... 6
2 Submit Documentation Feedback
Copyright © 2010–2017, Texas Instruments Incorporated
Product Folder Links: TLV705 TLV705P


Part Number TLV705
Description Low-Dropout Regulator
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