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TPA311 Datasheet Preview

TPA311 Datasheet

350-mW MONO AUDIO POWER AMPLIFIER

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TPA311
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
D Fully Specified for 3.3-V and 5-V Operation
D Wide Power Supply Compatibility
2.5 V – 5.5 V
D Output Power for RL = 8
– 350 mW at VDD = 5 V, BTL
– 250 mW at VDD = 5 V, SE
– 250 mW at VDD = 3.3 V, BTL
– 75 mW at VDD = 3.3 V, SE
D Shutdown Control
– IDD = 7 µA at 3.3 V
– IDD = 60 µA at 5 V
D BTL to SE Mode Control
D Integrated Depop Circuitry
D Thermal and Short-Circuit Protection
D Surface Mount Packaging
– SOIC
– PowerPADMSOP
description
D OR DGN PACKAGE
(TOP VIEW)
The TPA311 is a bridge-tied load (BTL) or
single-ended (SE) audio power amplifier devel-
oped especially for low-voltage applications
where internal speakers and external earphone
operation are required. Operating with a 3.3-V
SHUTDOWN 1 8 VO
BYPASS 2 7 GND
SE/BTL 3 6 VDD
IN 4 5 VO+
supply, the TPA311 can deliver 250-mW of
continuous power into a BTL 8-load at less than 1% THD+N throughout voice band frequencies. Although
this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as
cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the
output in most applications, which is particularly important for small battery-powered equipment. A unique
feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive
is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load.
This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually
eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an
8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by
50% and height by 40%.
Audio
Input
RI
CI
RF
CBF
4 IN
2 BYPASS
VDD/2
+
VDD 6
VO+ 5
CS
CC
From System Control
From HP Jack
1 SHUTDOWN
3 SE/BTL
Bias
Control
– VO– 8
+
7
GND
350 mW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1998 – 2003, Texas Instruments Incorporated
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1




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TPA311 Datasheet Preview

TPA311 Datasheet

350-mW MONO AUDIO POWER AMPLIFIER

No Preview Available !

TPA311
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C JANUARY 1998 REVISED MAY 2003
AVAILABLE OPTIONS
PACKAGED DEVICES
TA SMALL OUTLINE
(D)
MSOP
(DGN)
MSOP
Symbolization
40°C to 85°C
TPA311D
TPA311DGN
AAB
The D and DGN packages are available taped and reeled. To order a taped and reeled part, add
the suffix R to the part number (e.g., TPA311DR).
TERMINAL
NAME
NO.
BYPASS
2
GND
IN
7
4
SE/BTL
3
SHUTDOWN
VDD
VO+
VO
1
6
5
8
Terminal Functions
I/O DESCRIPTION
I
BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected
to a 0.1-µF to 1-µF capacitor when used as an audio amplifier.
GND is the ground connection.
I IN is the audio input terminal.
I
When SE/BTL is held low, the TPA311 is in BTL mode. When SE/BTL is held high, the TPA311 is in SE
mode.
I SHUTDOWN places the entire device in shutdown mode when held high (IDD = 60 µA, VDD = 5 V).
VDD is the supply voltage terminal.
O VO+ is the positive output for BTL and SE modes.
O VOis the negative output in BTL mode and a high-impedance output in SE mode.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VDD +0.3 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . internally limited (see Dissipation Rating Table)
Operating free-air temperature range, TA (see Table 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 85°C
Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
D
TA 25°C
725 mW
DERATING FACTOR
5.8 mW/°C
TA = 70°C
464 mW
TA = 85°C
377 mW
DGN
2.14 W§
17.1 mW/°C
1.37 W
1.11 W
§ Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(literature number SLMA002), for more information on the PowerPAD package. The thermal data was
measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended
Board for PowerPAD on page 33 of the before mentioned document.
2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265


Part Number TPA311
Description 350-mW MONO AUDIO POWER AMPLIFIER
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