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TPS2068 Datasheet Preview

TPS2068 Datasheet

POWER-DISTRIBUTION SWITCHES

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www.ti.com
D−8 DGN−8 DRB−8
TPS2060, TPS2064
TPS2068, TPS2069
SLVS553K MARCH 2005 REVISED MAY 2011
CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES
Check for Samples: TPS2060, TPS2064, TPS2068, TPS2069
FEATURES
1
2 70-mHigh-Side MOSFET
1.5-A Continuous Current
Thermal and Short-Circuit Protection
Accurate Current Limit (1.6 A min, 2.6 A max)
Operating Range: 2.7 V to 5.5 V
0.6-ms Typical Rise Time
Undervoltage Lockout
Deglitched Fault Report (OC)
No OC Glitch During Power Up
1-μA Maximum Standby Supply Current
Reverse Current Blocking
TPS2060/64 Temperature Range: 0°C to 70°C
TPS2068/69 DGN Package Temperature
Range: 40°C to 85°C
TPS2068 D Package Temperature Range:
0°C to 70°C
UL Listed File No. E169910
TPS2068/69: CB Certified
APPLICATIONS
Heavy Capacitive Loads
Short-Circuit Protections
TPS2060/TPS2064
DGN PACKAGE
(TOP VIEW)
TPS2060/TPS2064
DRB PACKAGES
(TOP VIEW)
GND
IN
EN1
EN2
1
2
3
4
8 OC1
GND 1
7 OUT1
6 OUT2
5 OC2
IN
EN1
EN2
2
3
4
TPS2068
D PACKAGE
(TOP VIEW)
8 OC1
7 OUT1
6 OUT2
5 OC2
GND
1
8 OUT
IN 2
7 OUT
IN 3
6 OUT
EN 4
5 OC
TPS2068
DGN PACKAGE
(TOP VIEW)
TPS2069
DGN PACKAGE
(TOP VIEW)
GND
IN
IN
EN
1
2
3
4
8 OUT
7 OUT
6 OUT
5 OC
GND
IN
IN
EN
1
2
3
4
8 OUT
7 OUT
6 OUT
5 OC
† All enable inputs are active high for the TPS2064 devices.
DESCRIPTION
The TPS206x power-distribution switches are intended for applications where heavy capacitive loads and
short-circuits are likely to be encountered. This device incorporates 70-mN-channel MOSFET power switches
for power-distribution systems that require single or dual power switches in a single package. Each switch is
controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to control the
power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no
external components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When
continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction
temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal
shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains
off until valid input voltage is present. Current limit is typically 2.1 A.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPad is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 20052011, Texas Instruments Incorporated




etcTI

TPS2068 Datasheet Preview

TPS2068 Datasheet

POWER-DISTRIBUTION SWITCHES

No Preview Available !

TPS2060, TPS2064
TPS2068, TPS2069
SLVS553K MARCH 2005 REVISED MAY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
TA
0°C to 70°C
40°C to 85°C
0°C to 70°C
ENABLE
Active low
Active high
Active low
Active high
Active low
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMENDED
MAXIMUM
CONTINUOUS
LOAD CURRENT
TYPICAL
SHORT-CIRCUIT
CURRENT LIMIT
AT 25°C
NUMBER OF
SWITCHES
PACKAGED
DEVICES (1) (2)
MSOP (DGN)
SON (DRB)
Dual
TPS2060DGN
TPS2064DGN
TPS2060DRB
TPS2064DRB
1.5 A
2.1 A
Single
TPS2068DGN
TPS2069DGN
Single
TPS2068D
(1) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2060DGN).
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
Input voltage range, VI(IN)
VI Input voltage range, VI(/ENx), VI(ENx)
Voltage range, VI(/OC), VI(/OCx)
VO Output voltage range, VO(OUT), VO(OUTx)
IO Continuous output current, IO(OUT), IO(OUTx)
Continuous total power dissipation
TJ
Operating virtual junction temperature
range
Tstg Storage temperature range
ESD Electrostatic discharge protection
TPS2060/64
TPS2068/69 (DGN Package)
TPS2068 (D Package)
Human body model MIL-STD-883C
Charge device model (CDM)
UNIT
0.3 V to 6 V
0.3 V to 6 V
0.3 V to 6 V
0.3 V to 6 V
Internally limited
See Dissipation Rating Table
0°C to 105°C
40°C to 105°C
0°C to 105°C
65°C to 150°C
2 kV
500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATING RATING TABLE(1)
PACKAGE
DGN-8 (2)
THERMAL
RESISTANCE
θJA
TA < 25°C
POWER RATING
1370 mW
D-8
DRB-8 (Low-K)(3)
DRB-8 (High-K)(4)
270 °CW
60 °CW
585.82 mW
370 mW
1600 mW
DERATING
FACTOR
ABOVE TA = 25°C
17 mW/°C
5.8582 mW/°C
3.71 mW/°C
16.67 mW/°C
TA = 70°C
POWER RATING
600 mW
322.20 mW
203 mW
916 mW
TA = 85°C
POWER RATING
342 mW
234.32 mW
148 mW
866 mW
(1) Heatsink the PowerPadper the recommendations of SLMA002. PCB used for recommendations per appendix A4.
(2) See Recommended Operating Conditions Table for PowerPad connection guidelines to meet qualifying conditions for CB Certificate.
(3) Soldered PowerPAD on a standard 2-layer PCB without vias for thermal pad. See TI application note SLMA002 for further details.
(4) Soldered PowerPAD on a standard 4-layer PCB with vias for thermal pad. See TI application note SLMA002 for further details.
2 Copyright © 20052011, Texas Instruments Incorporated


Part Number TPS2068
Description POWER-DISTRIBUTION SWITCHES
Maker etcTI
Total Page 30 Pages
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