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TPS650243-Q1 Datasheet Preview

TPS650243-Q1 Datasheet

POWER MANAGEMENT IC

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TPS650241-Q1, TPS650243-Q1, TPS650244-Q1
www.ti.com
SLVS994A SEPTEMBER 2009 REVISED MARCH 2011
POWER MANAGEMENT ICs FOR Li-ION POWERED SYSTEMS
Check for Samples: TPS650241-Q1, TPS650243-Q1, TPS650244-Q1
FEATURES
1
APPLICATIONS
Qualified for Automotive Applications
1.6-A, 1.0-A or 0.8-A, 97% Efficient Step-Down
Converter for System Voltage (VDCDC1)
3.3-V or 2.80-V or Adjustable
1.6-A, 1.0-A or 0.8-A, up to 95% Efficient
Step-Down Converter for Memory Voltage
(VDCDC2)
PDA
Cellular/Smart Phone
GPS
Digital Still Camera
Split Supply DSP and Microprocessor
Solutions: Samsung ARM-Based Processors,
etc.
1.8 V or 2.5 V or Adjustable
0.8-A 90% Efficient Step-Down Converter for
Processor Core (VDCDC3)
Three Selectable Voltages for VDCDC3
TPS650241
DEFDCDC3 = LOW: VO = 0.9 V
DEFDCDC3 = HIGH: VO = 1.375 V
TPS650243
DEFDCDC3 = LOW: VO = 1.0 V
DEFDCDC3 = HIGH: VO = 1.2 V
TPS650244
DEFDCDC3 = LOW: VO = 1.55 V
DEFDCDC3 = HIGH: VO = 1.6 V
30-mA LDO for Vdd_alive
Two 200-mA General Purpose LDOs (LDO1
and LDO2)
Dynamic Voltage Management for Processor
Core
LDO1 and LDO2 Voltage Externally Adjustable
Separate Enable Pins for Inductive Converters
2.25-MHz Switching Frequency
85-μA Quiescent Current
Thermal Shutdown Protection
DESCRIPTION
The TPS65024x are integrated Power Management
ICs for applications powered by one Li-Ion or
Li-Polymer cell, which require multiple power rails.
The TPS65024x provide three highly efficient,
step-down converters targeted at providing the core
voltage, peripheral, I/O and memory rails in a
processor based system. All three step-down
converters enter a low power mode at light load for
maximum efficiency across the widest possible range
of load currents. The converters can be forced into
fixed frequency PWM mode by pulling the MODE pin
high. The TPS65024x also integrate two general
purpose 200-mA LDO voltage regulators, which are
enabled with an external input pin. Each LDO
operates with an input voltage range between 1.5 V
and 6.5 V, allowing them to be supplied from one of
the step-down converters or directly from the battery.
The output voltage of the LDOs can be set with an
external resistor divider for maximum flexibility.
Additionally there is a 30-mA LDO typically used to
provide power in a processor based system to a
voltage rail that is always on. TPS65024x provide
voltage scaling on DCDC3 using the DEFDCDC3 pin.
This pin either needs to be connected to a logic HIGH
or logic LOW level to set the output voltage of
DCDC3. TPS65024x come in a small 5-mm x 5-mm
32-pin QFN package (RHB).
ORDERING INFORMATION(1)
TA
PACKAGE (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
40°C to 125°C
QFN RHB
Reel of 3000
TPS650241QRHBRQ1
TPS650243QRHBRQ1
TPS650241Q
TPS650243Q
40°C to 85°C
TPS650244IRHBRQ1
TPS650244Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 20092011, Texas Instruments Incorporated




etcTI

TPS650243-Q1 Datasheet Preview

TPS650243-Q1 Datasheet

POWER MANAGEMENT IC

No Preview Available !

TPS650241-Q1, TPS650243-Q1, TPS650244-Q1
SLVS994A SEPTEMBER 2009 REVISED MARCH 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
Input voltage range on all pins except A/PGND, VLDO1 and VLDO2 pins with respect to
AGND
Voltage range on pins VLDO1 and VLDO2 with respect to AGND
Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, PGND3
Peak current at all other pins
Continuous total power dissipation
TJ Operating junction temperature
Tst Storage temperature
Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds
VALUE
0.3 to 7
UNIT
V
0.3 to 3.6
2000
1000
See Dissipation Rating Table
40 to 125
65 to 150
260
V
mA
mA
°C
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
PACKAGE (1)
RθJA
TJ 25°C
POWER RATING
RHB
35°C/W
2.85 W
DERATING FACTOR
ABOVE TJ = 25°C
28 mW/°C
TJ = 70°C
POWER RATING
1.57 W
TJ = 85°C
POWER RATING
1.14 W
(1) The thermal resistance junction to ambient of the RHB package is measured on a high K board. The thermal resistance junction to
power pad is 1.5°C/W.
2 Submit Documentation Feedback
Copyright © 20092011, Texas Instruments Incorporated
Product Folder Link(s): TPS650241-Q1 TPS650243-Q1 TPS650244-Q1


Part Number TPS650243-Q1
Description POWER MANAGEMENT IC
Maker etcTI
Total Page 30 Pages
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