TPS799
SBVS056K – JANUARY 2005 – REVISED JANUARY 2015
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
5.1 Fixed Voltage Versions ............................................. 3
5.2 Adjustable Voltage Versions ..................................... 3
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings ............................................................ 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 13
8 Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Applications ................................................ 14
8.3 Do's and Don'ts ...................................................... 16
9 Power Supply Recommendations...................... 16
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example .................................................... 17
10.3 Thermal Information .............................................. 17
11 Device and Documentation Support ................. 18
11.1 Device Support...................................................... 18
11.2 Documentation Support ........................................ 18
11.3 Trademarks ........................................................... 18
11.4 Electrostatic Discharge Caution ............................ 18
11.5 Glossary ................................................................ 18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision J (August 2010) to Revision K
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Changed Features list ........................................................................................................................................................... 1
• Changed Description section.................................................................................................................................................. 1
• Changed figure on front page; replaced device pinouts with application circuits................................................................... 1
• Changed Pin Configuration and Functions section; updated table format, renamed pin packages to meet new
standards ............................................................................................................................................................................... 3
• Changed "free-air" to "junction" temperature in condition statement for Absolute Maximum Ratings .................................. 5
• Changed free-air to junction in Recommended Operating Conditions table conditions......................................................... 5
• Added thermal information for additional device packages ................................................................................................... 5
Changes from Revision I (November 2007) to Revision J
Page
• Replaced the Dissipation Ratings table with the Thermal Information table .......................................................................... 5
2
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