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TXS0206-29 Datasheet Preview

TXS0206-29 Datasheet

Voltage-Level Translator

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TXS0206-29
www.ti.com
SCES690 – DECEMBER 2009
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER AND LDO
VOLTAGE REGULATOR WITH ESD PROTECTION AND EMI FILTERING
FEATURES
1
• Level Translator
– VCCA Range of 1.1 V to 3.6 V
– Fast Propagation Delay (4 ns Max When
Translating Between 1.8 V and 2.9 V)
• Low-Dropout (LDO) Regulator
– 200-mA LDO Regulator With Enable
– 2.9-V Output Voltage
– 3.05-V to 5.5-V Input Voltage Range
– Very Low Dropout: 200 mV at 200 mA
YFP PACKAGE
(TOP VIEW)
1234
A
B
C
D
E
• ESD Protection Exceeds JESD 22 (A Port)
– 2000-V Human-Body Model (A114-B)
– 1000-V Charged-Device Model (C101)
• ±8-kV Contact Discharge IEC 61000-4-2 ESD
(B Port)
TERMINAL ASSIGNMENTS
1
2
3
4
A
DAT2A
VCCA
WP/CD
DAT2B
B
DAT3A
VBATT
VCCB O/P
DAT3B
C
CMDA
GND
GND
CMDB
D
DAT0A
CLKA
CLKB
DAT0B
E
DAT1A
CLK-f
EN
DAT1B
DESCRIPTION/ORDERING INFORMATION
The TXS0206-29 is a complete solution for interfacing microprocessors with MultiMediaCards (MMCs), secure
digital (SD) cards, and Memory Stick™ cards. It is comprised of a high-speed level translator, a low-dropout
(LDO) voltage regulator, IEC level ESD protection, and EMI filtering circuitry.
The voltage-level translator has two supply voltage pins. VCCA can be operated over the full range of 1.1 V to
3.6 V. VCCB is set at 2.9 V and is supplied by an internal LDO. The integrated LDO accepts input voltages from
3.05V to as high as 5.5 V and outputs 2.9 V, 200 mA to the B-side circuitry and to the external memory card. The
TXS0206-29 enables system designers to easily interface low-voltage microprocessors to memory cards
operating at 2.9 V.
Memory card standards recommend high-ESD protection for devices that connect directly to the external memory
card. To meet this need, the TXS0206-29 incorporates ±8-kV Contact Discharge protection on the card side.
Since memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players,
camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206-29 an
ideal choice for these applications. The TXS0206-29 is offered in a 20-bump wafer chip scale package (WCSP).
This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings
TA
–40°C to 85°C
ORDERING INFORMATION(1)
PACKAGE (2)
ORDERABLE PART NUMBER
WCSP – YFP (Pb-free)
Tape and reel
TXS0206-29YFPR
TOP-SIDE MARKING(3)
___3V2
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated




etcTI

TXS0206-29 Datasheet Preview

TXS0206-29 Datasheet

Voltage-Level Translator

No Preview Available !

TXS0206-29
SCES690 – DECEMBER 2009
VCCA
REFERENCE DESIGN
VCCB
VCCB
www.ti.com
C3
0.1 μF
C4
0.1 μF
C1
0.1 μF
U1A
VDDA
DAT0
DAT1
DAT2
DAT3
CMD
CLK
CLKin
GND
WP/CD
Processor
SD/SDIO MMC
CPU
U2
A2
VCCA
VCCB O/P B3
D1
DAT0A
E1
DAT1A
D4 DAT0B
DAT0B
A1
DAT2A
B1
DAT3A
C1
CMDA
D2
CLKA
E2
CLK-f
DAT1B E4 DAT1B
DAT2B A4 DAT2B
DAT3B B4 DAT3B
CMDB
CLKB
C4
D3
CMDB
CLKB
C2
GND
C3
GND
A3
WP/CD
TXS0206-29
WP/CD
DAT2B
DAT3B
CMDB
CLKB
DAT0B
DAT1B
CD
WP
J1
0 DAT2
1
2
DAT3
CMD
3
4
VSS1
VDD
5 CLK
6 VSS2
7 DAT0
8 DAT1
9
10
WP/CD (Physical)
CD (Physical)
11
12
GND
GND
13 WP (Physical)
54794-0978
SD/SDIO
CardConnector
Figure 1. Interfacing With SD/SDIO Card
ESD – 2 kV
1.8 V
A Side
ESD – ±8-kV Contact Discharge
B Side 2.9 V
CLK
Feedback CLK
CMD
Data 0–3
EN
WP, CD
Level-Shifter
Integrated
ASIP
EMI Filter
WP, CD 1.8-V Pullup
Integrated PSU
2.9 V, 200 mA
CLK
CMD
Data 0–3
Antenna
Pins 10, 11
MMC,
SD Card, or
MS Card
WP, CD
Integrated Pullup/Pulldown Resistors
Figure 2. Typical Application Circuit
2
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Copyright © 2009, Texas Instruments Incorporated


Part Number TXS0206-29
Description Voltage-Level Translator
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