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UCC27423 Datasheet

Dual 4-A High Speed Low-Side MOSFET Drivers

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UCC27423, UCC27424, UCC27425

SLUS545E – NOVEMBER 2002 – REVISED DECEMBER 2015

UCC2742x Dual 4-A High Speed Low-Side MOSFET Drivers With Enable

1 Features

•1 Industry-Standard Pin-Out

• Enable Functions for Each Driver

• High Current Drive Capability of ±4 A

• Unique BiPolar and CMOS True Drive Output

Stage Provides High Current at MOSFET Miller

Thresholds

• TTL/CMOS Compatible Inputs Independent of

Supply Voltage

• 20-ns Typical Rise and 15-ns Typical Fall Times

with 1.8-nF Load

• Typical Propagation Delay Times of 25 ns with

Input Falling and 35 ns with Input Rising

• 4-V to 15-V Supply Voltage

• Dual Outputs Can Be Paralleled for Higher Drive

Current

• Available in Thermally Enhanced MSOP

PowerPAD™ Package

• Rated From –40°C to 125°C

2 Applications

• Switch Mode Power Supplies

• DC/DC Converters

• Motor Controllers

• Line Drivers

• Class D Switching Amplifiers

3 Description

The UCC2742x family of high-speed dual MOSFET

drivers can deliver large peak currents into capacitive

loads. Three standard logic options are offered –

dual-inverting, dual-noninverting, and one-inverting

and one-noninverting driver. The thermally enhanced

8-pin PowerPAD™ MSOP package (DGN) drastically

lowers the thermal resistance to improve long-term

reliability. It is also offered in the standard SOIC-8 (D)

or PDIP-8 (P) packages.

Using a design that inherently minimizes shoot-

through current, these drivers deliver 4A of current

where it is needed most at the Miller plateau region

during the MOSFET switching transition. A unique

BiPolar and MOSFET hybrid output stage in parallel

also allows efficient current sourcing and sinking at

low supply voltages.

The UCC2742x provides enable (ENB) functions to

have better control of the operation of the driver

applications. ENBA and ENBB are implemented on

pins 1 and 8 which were previously left unused in the

industry standard pin-out. They are internally pulled

up to VDD for active high logic and can be left open

for standard operation.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

UCC27423

UCC27424

UCC27425

SOIC (8)

MSOP-PowerPAD (8)

PDIP (8)

4.90 mm × 3.91 mm

3.00 mm × 3.00 mm

9.81 mm × 6.35 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Simplified Application Diagram

ENBB

ENBA

UCC2742x

1 ENBA

ENBB 8

INA

2 INA

OUTA 7

GND

INB

3 GND

VDD 6

4 INB

OUTB 5

V+

GND

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

etcTI

UCC27423 Datasheet Preview

UCC27423 Datasheet

Dual 4-A High Speed Low-Side MOSFET Drivers

No Preview Available !

UCC27423, UCC27424, UCC27425

SLUS545E – NOVEMBER 2002 – REVISED DECEMBER 2015

www.ti.com

Table of Contents

1 Features .................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Device Comparison Table..................................... 3

6 Pin Configuration and Functions ......................... 3

7 Specifications......................................................... 4

7.1 Absolute Maximum Ratings ...................................... 4

7.2 ESD Ratings.............................................................. 4

7.3 Recommended Operating Conditions....................... 4

7.4 Thermal Information .................................................. 4

7.5 Electrical Characteristics........................................... 5

7.6 Dissipation Ratings ................................................... 6

7.7 Typical Characteristics .............................................. 7

8 Detailed Description ............................................ 12

8.1 Overview ................................................................. 12

8.2 Functional Block Diagram ....................................... 12

8.3 Feature Description................................................. 12

8.4 Device Functional Modes........................................ 13

9 Application and Implementation ........................ 14

9.1 Application Information............................................ 14

9.2 Typical Application ................................................. 14

10 Power Supply Recommendations ..................... 19

11 Layout................................................................... 19

11.1 Layout Guidelines ................................................. 19

11.2 Layout Example .................................................... 20

11.3 Thermal Considerations ........................................ 20

12 Device and Documentation Support ................. 21

12.1 Device Support...................................................... 21

12.2 Documentation Support ........................................ 21

12.3 Related Links ........................................................ 21

12.4 Community Resources.......................................... 21

12.5 Trademarks ........................................................... 22

12.6 Electrostatic Discharge Caution ............................ 22

12.7 Glossary ................................................................ 22

13 Mechanical, Packaging, and Orderable

Information ........................................................... 22

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (May 2013) to Revision E

Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section .................................................................................................. 1

Changes from Revision C (July 2011) to Revision D

Page

• Added Pin Functions table note.............................................................................................................................................. 3

• Added ABSOLUTE MAXIMUM RATINGS note...................................................................................................................... 4

• Added additional ENABLE pin description. .......................................................................................................................... 12

Changes from Revision B (November 2004) to Revision C

Page

• Changed temperature rating................................................................................................................................................... 1

• Changed ORDERING INFORMATION temperature range, three instances. ........................................................................ 1

• Changed Output current (OUTA, OUTB) DC from 0.3 A to 0.2 A.......................................................................................... 4

• Changed ELECTRICAL CHARACTERISTICS temperature rating. ....................................................................................... 5

• Changed Low-level output level from 40 mV max to 45 mV max. ......................................................................................... 5

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