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UCC27512 Datasheet Preview

UCC27512 Datasheet

Low-Side Gate Driver

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UCC27511, UCC27512
SLUSAW9F – FEBRUARY 2012 – REVISED NOVEMBER 2014
UCC2751x Single-Channel, High-Speed, Low-Side Gate Driver (With 4-A Peak Source and
8-A Peak Sink)
1 Features
• Low-Cost Gate-Driver Device Offering Superior
Replacement of NPN and PNP Discrete Solutions
• 4-A Peak Source and 8-A Peak Sink
Asymmetrical Drive
• Strong Sink Current Offers Enhanced Immunity
Against Miller Turnon
• Split Output Configuration (Allows Easy and
Independent Adjustment of Turnon and Turnoff
Speeds) in the UCC27511 Saves 1 Diode
• Fast Propagation Delays (13-ns Typical)
• Fast Rise and Fall Times (9-ns and 7-ns Typical)
• 4.5-V to 18-V Single Supply Range
• Outputs Held Low During VDD UVLO (Ensures
Glitch-Free Operation at Power Up and Power
Down)
• TTL and CMOS Compatible Input-Logic Threshold
(Independent of Supply Voltage)
• Hysteretic-Logic Thresholds for High-Noise
Immunity
• Dual-Input Design (Choice of an Inverting (IN–
Pin) or Noninverting (IN+ Pin) Driver
Configuration)
– Unused Input Pin can be Used for Enable or
Disable Function
• Output Held Low When Input Pins Are Floating
• Input Pin Absolute Maximum Voltage Levels Not
Restricted by VDD Pin Bias Supply Voltage
• Operating Temperature Range of –40°C to 140°C
1
• 6-Pin DBV (SOT-23) and 6-Pin DRS (3-mm ×
3-mm WSON With Exposed Thermal Pad)
Package Options
2 Applications
• Switched-Mode Power Supplies
• DC-to-DC Converters
• Companion Gate-Driver Devices for Digital Power
Controllers
• Solar Power, Motor Control, UPS
• Gate Driver for Emerging Wide Band-Gap Power
Devices (such as GaN)
3 Description
The UCC27511 and UCC27512 single-channel, high-
speed, low-side gate-driver device can effectively
drive MOSFET and IGBT power switches. Using a
design that inherently minimizes shoot-through
current, UCC27511 and UCC27512 are capable of
sourcing and sinking high peak-current pulses into
capacitive loads offering rail-to-rail drive capability
and extremely small propagation delay, typically 13
ns.
Device Information(1)
PART NUMBER PACKAGE
BODY SIZE (NOM)
UCC27511
SOT-23 (6)
2.90 mm x 1.60 mm
UCC27512
WSON (6)
3.00 mm x 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Application Diagrams
Noninverting Input
V+
4.5 V to 18 V
VSOURCE
C2
Noninverting Input
VSOURCE
UCC27511
IN+ 6 IN+
VDD 1
5 IN-
OUTH 2
R1
4 GND
OUTL 3
R2
L1
D1
Q1
VOUT
+
C1
UCC27512
IN+ 1 IN+
IN- 6
4.5 V to 18 V
V+
C2
2 GND
3 VDD
GND 5
OUT 4
L1
D1
Q1
VOUT
+
R3 C1
Inverting Input
Inverting Input
V+
4.5 V to 18 V
VSOURCE
C2
VSOURCE
UCC27511
6 IN+
VDD 1
R1
IN-
5 IN-
OUTH 2
4 GND
OUTL 3
R2
L1
D1
Q1
VOUT
+
C1
4.5 V to 18 V
V+
C2
UCC27512
1 IN+
IN- 6
2 GND
GND 5
3 VDD
OUT 4
IN -
R3
L1
D1
Q1
+
C1
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.




etcTI

UCC27512 Datasheet Preview

UCC27512 Datasheet

Low-Side Gate Driver

No Preview Available !

UCC27511, UCC27512
SLUSAW9F – FEBRUARY 2012 – REVISED NOVEMBER 2014
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (Continued) ........................................ 4
6 UCC2751x Product Family .................................... 4
7 Pin Configuration and Functions ......................... 5
8 Specifications......................................................... 7
8.1 Absolute Maximum Ratings ...................................... 7
8.2 Handling Ratings....................................................... 7
8.3 Recommended Operating Conditions....................... 7
8.4 Thermal Information .................................................. 8
8.5 Electrical Characteristics........................................... 9
8.6 Switching Characteristics ........................................ 10
8.7 Typical Characteristics ............................................ 12
9 Detailed Description ............................................ 15
9.1 Overview ................................................................. 15
9.2 Functional Block Diagram ....................................... 15
9.3 Feature Description................................................. 16
9.4 Device Functional Modes........................................ 21
10 Application and Implementation........................ 22
10.1 Application Information.......................................... 22
10.2 Typical Application ................................................ 22
11 Power Supply Recommendations ..................... 27
12 Layout................................................................... 27
12.1 Layout Guidelines ................................................. 27
12.2 Layout Example .................................................... 28
13 Device and Documentation Support ................. 29
13.1 Related Links ........................................................ 29
13.2 Trademarks ........................................................... 29
13.3 Electrostatic Discharge Caution ............................ 29
13.4 Glossary ................................................................ 29
14 Mechanical, Packaging, and Orderable
Information ........................................................... 29
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (December 2013) to Revision F
Page
• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1
Changes from Revision D (May 2013) to Revision E
Page
• Changed OUTL in the ABS Max Ratings table to show DC and Repetitive pulse values ..................................................... 7
Changes from Revision C (June 2012) to Revision D
Page
• Added 0.05 to PSW equation in the Power Dissipation section. ........................................................................................... 26
Changes from Revision B (March, 2012) to Revision C
Page
• Added UCC27512 device throughout. ................................................................................................................................... 1
• Added 6-Pin DRS package feature. ....................................................................................................................................... 1
• Added DRS pinout for the UCC27512.................................................................................................................................... 5
• Added UCC27512 TERMINAL FUNCTIONS table. ............................................................................................................... 6
• Added OUT voltage ab max ratings for the UCC27512. ........................................................................................................ 7
• Added (1) ................................................................................................................................................................................. 7
• Changed ESD ratings of Human Body Model, HBM from 2000 V to 4000 V. ....................................................................... 7
• Changed ESD ratings of Charged Device Model, CDM SOT-23 from 500 V to 1000 V........................................................ 7
• Added UCC27512 Thermal Information. ................................................................................................................................ 8
• Added power dissipation conditions note to Thermal Information section. ............................................................................ 8
• Added UCC27512 Functional Block Diagram. ..................................................................................................................... 16
(1) Values are verified by characterization on bench.
2 Submit Documentation Feedback
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: UCC27511 UCC27512


Part Number UCC27512
Description Low-Side Gate Driver
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