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UCC27512 Datasheet Preview

UCC27512 Datasheet

Low-Side Gate Driver

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UCC27511, UCC27512

SLUSAW9F – FEBRUARY 2012 – REVISED NOVEMBER 2014

UCC2751x Single-Channel, High-Speed, Low-Side Gate Driver (With 4-A Peak Source and

8-A Peak Sink)

1 Features

• Low-Cost Gate-Driver Device Offering Superior

Replacement of NPN and PNP Discrete Solutions

• 4-A Peak Source and 8-A Peak Sink

Asymmetrical Drive

• Strong Sink Current Offers Enhanced Immunity

Against Miller Turnon

• Split Output Configuration (Allows Easy and

Independent Adjustment of Turnon and Turnoff

Speeds) in the UCC27511 Saves 1 Diode

• Fast Propagation Delays (13-ns Typical)

• Fast Rise and Fall Times (9-ns and 7-ns Typical)

• 4.5-V to 18-V Single Supply Range

• Outputs Held Low During VDD UVLO (Ensures

Glitch-Free Operation at Power Up and Power

Down)

• TTL and CMOS Compatible Input-Logic Threshold

(Independent of Supply Voltage)

• Hysteretic-Logic Thresholds for High-Noise

Immunity

• Dual-Input Design (Choice of an Inverting (IN–

Pin) or Noninverting (IN+ Pin) Driver

Configuration)

– Unused Input Pin can be Used for Enable or

Disable Function

• Output Held Low When Input Pins Are Floating

• Input Pin Absolute Maximum Voltage Levels Not

Restricted by VDD Pin Bias Supply Voltage

• Operating Temperature Range of –40°C to 140°C

• 6-Pin DBV (SOT-23) and 6-Pin DRS (3-mm ×

3-mm WSON With Exposed Thermal Pad)

Package Options

2 Applications

• Switched-Mode Power Supplies

• DC-to-DC Converters

• Companion Gate-Driver Devices for Digital Power

Controllers

• Solar Power, Motor Control, UPS

• Gate Driver for Emerging Wide Band-Gap Power

Devices (such as GaN)

3 Description

The UCC27511 and UCC27512 single-channel, high-

speed, low-side gate-driver device can effectively

drive MOSFET and IGBT power switches. Using a

design that inherently minimizes shoot-through

current, UCC27511 and UCC27512 are capable of

sourcing and sinking high peak-current pulses into

capacitive loads offering rail-to-rail drive capability

and extremely small propagation delay, typically 13

ns.

Device Information(1)

PART NUMBER PACKAGE

BODY SIZE (NOM)

UCC27511

SOT-23 (6)

2.90 mm x 1.60 mm

UCC27512

WSON (6)

3.00 mm x 3.00 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

Typical Application Diagrams

Noninverting Input

V+

4.5 V to 18 V

VSOURCE

Noninverting Input

VSOURCE

UCC27511

IN+ 6 IN+

VDD 1

5 IN-

OUTH 2

4 GND

OUTL 3

VOUT

UCC27512

IN+ 1 IN+

IN- 6

4.5 V to 18 V

V+

2 GND

3 VDD

GND 5

OUT 4

VOUT

R3 C1

Inverting Input

V+

4.5 V to 18 V

VSOURCE

UCC27511

6 IN+

VDD 1

IN-

5 IN-

OUTH 2

4 GND

OUTL 3

VOUT

4.5 V to 18 V

V+

UCC27512

1 IN+

IN- 6

2 GND

GND 5

3 VDD

OUT 4

IN -

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

etcTI

UCC27512 Datasheet Preview

UCC27512 Datasheet

Low-Side Gate Driver

No Preview Available !

UCC27511, UCC27512

SLUSAW9F – FEBRUARY 2012 – REVISED NOVEMBER 2014

www.ti.com

Table of Contents

1 Features .................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Description (Continued) ........................................ 4

6 UCC2751x Product Family .................................... 4

7 Pin Configuration and Functions ......................... 5

8 Specifications......................................................... 7

8.1 Absolute Maximum Ratings ...................................... 7

8.2 Handling Ratings....................................................... 7

8.3 Recommended Operating Conditions....................... 7

8.4 Thermal Information .................................................. 8

8.5 Electrical Characteristics........................................... 9

8.6 Switching Characteristics ........................................ 10

8.7 Typical Characteristics ............................................ 12

9 Detailed Description ............................................ 15

9.1 Overview ................................................................. 15

9.2 Functional Block Diagram ....................................... 15

9.3 Feature Description................................................. 16

9.4 Device Functional Modes........................................ 21

10 Application and Implementation........................ 22

10.1 Application Information.......................................... 22

10.2 Typical Application ................................................ 22

11 Power Supply Recommendations ..................... 27

12 Layout................................................................... 27

12.1 Layout Guidelines ................................................. 27

12.2 Layout Example .................................................... 28

13 Device and Documentation Support ................. 29

13.1 Related Links ........................................................ 29

13.2 Trademarks ........................................................... 29

13.3 Electrostatic Discharge Caution ............................ 29

13.4 Glossary ................................................................ 29

14 Mechanical, Packaging, and Orderable

Information ........................................................... 29

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (December 2013) to Revision F

Page

• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device

Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

Changes from Revision D (May 2013) to Revision E

Page

• Changed OUTL in the ABS Max Ratings table to show DC and Repetitive pulse values ..................................................... 7

Changes from Revision C (June 2012) to Revision D

Page

• Added 0.05 to PSW equation in the Power Dissipation section. ........................................................................................... 26

Changes from Revision B (March, 2012) to Revision C

Page

• Added UCC27512 device throughout. ................................................................................................................................... 1

• Added 6-Pin DRS package feature. ....................................................................................................................................... 1

• Added DRS pinout for the UCC27512.................................................................................................................................... 5

• Added UCC27512 TERMINAL FUNCTIONS table. ............................................................................................................... 6

• Added OUT voltage ab max ratings for the UCC27512. ........................................................................................................ 7

• Added (1) ................................................................................................................................................................................. 7

• Changed ESD ratings of Human Body Model, HBM from 2000 V to 4000 V. ....................................................................... 7

• Changed ESD ratings of Charged Device Model, CDM SOT-23 from 500 V to 1000 V........................................................ 7

• Added UCC27512 Thermal Information. ................................................................................................................................ 8

• Added power dissipation conditions note to Thermal Information section. ............................................................................ 8

• Added UCC27512 Functional Block Diagram. ..................................................................................................................... 16

(1) Values are verified by characterization on bench.

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