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74LVC3G34GF Datasheet Preview

74LVC3G34GF Datasheet

Triple buffer

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74LVC3G34
Triple buffer
Rev. 13 — 26 October 2018
Product data sheet
1. General description
The 74LVC3G34 provides three buffers.
The inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the
74LVC3G34 as a translator in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry
disables the output, preventing a damaging backflow current through the device when it is powered
down.
2. Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8B/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
±24 mA output drive (VCC = 3.0 V)
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C




nexperia

74LVC3G34GF Datasheet Preview

74LVC3G34GF Datasheet

Triple buffer

No Preview Available !

Nexperia
74LVC3G34
Triple buffer
3. Ordering information
Table 1. Ordering information
Type number
Package
Temperature range
74LVC3G34DP
-40 °C to +125 °C
Name
TSSOP8
74LVC3G34DC
-40 °C to +125 °C VSSOP8
74LVC3G34GT
-40 °C to +125 °C XSON8
74LVC3G34GF
-40 °C to +125 °C XSON8
74LVC3G34GM
-40 °C to +125 °C XQFN8
74LVC3G34GN
-40 °C to +125 °C XSON8
74LVC3G34GS
-40 °C to +125 °C XSON8
Description
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
plastic very thin shrink small outline package;
8 leads; body width 2.3 mm
plastic extremely thin small outline package;
no leads; 8 terminals; body 1 × 1.95 × 0.5 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1 × 0.5 mm
plastic, extremely thin quad flat package;
no leads; 8 terminals; body 1.6 × 1.6 × 0.5 mm
extremely thin small outline package; no leads;
8 terminals; body 1.2 × 1.0 × 0.35 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1.0 × 0.35 mm
Version
SOT505-2
SOT765-1
SOT833-1
SOT1089
SOT902-2
SOT1116
SOT1203
4. Marking
Table 2. Marking codes
Type number
74LVC3G34DP
74LVC3G34DC
74LVC3G34GT
74LVC3G34GF
74LVC3G34GM
74LVC3G34GN
74LVC3G34GS
Marking code [1]
V34
Y34
Y34
YA
Y34
YA
YA
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
1A
1Y
3Y
3A
2A
2Y
001aah842
Fig. 1. Logic symbol
1
1
1
001aah843
Fig. 2. IEC logic symbol
A
Y
001aac536
Fig. 3. Logic diagram (one gate)
74LVC3G34
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 26 October 2018
© Nexperia B.V. 2018. All rights reserved
2 / 17


Part Number 74LVC3G34GF
Description Triple buffer
Maker nexperia
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74LVC3G34GF Datasheet PDF






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