HSMP-389x Datasheet | Agilent Technologies

Features - Unique Configurations in Surface Mount Packages - Add Flexibility - Save Board Space - Reduce Cost - Switching - Low Capacitance - Low Resistance at Low Current - Low Failure in Time (FIT) Rate[1] - Matched Diodes for Consistent Performance - Better Thermal Conductivity for Higher Power Dissipation Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. Pin Connections and Package Marking 1 2 3 6 5 4 Description /Applications The HSMP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The HSMP-489x series products feature ultra low parasitic inductance. These products are specifically designed for use at frequencies which are much higher than the upper limit for conventional PIN diodes. Notes: 1. Package marking provides orientation, identification, and date code. 2. See “Electrical Specifications” for appropriate package marking. GUx .. Package Lead Code Identification, SOT-23/143 (Top View) SINGLE SERIES Package Lead Code Identification, SOT-323 (Top View) SINGLE SERIES Package Lead Code Identification, SOT-363 (Top View) UNCONNECTED TRIO 6 5 4 DUAL SWITCH MODEL 6 5 4 #0 MON ANODE #2 MON CATHODE B MON ANODE C MON...