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CSOIC Datasheet - Amkor Technology

CSOIC_AmkorTechnology.pdf

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Datasheet Details

Part number:

CSOIC

Manufacturer:

Amkor Technology

File Size:

392.27 KB

Description:

Ceramic small outline integrated circuit package.

CSOIC, Ceramic Small Outline Integrated Circuit Package

data sheet Ceramic Small Outline Integrated Circuit Package (CSOIC) This is a ceramic version of the Plastic SOIC package.

The CSOIC is a hermetic package consisting of a multilayer ceramic surrounding a "gullwing" formed leadframe.

This package has leads extending from two sides of the package (dual).

The package is hermetically solder sealed at 325° Centigrade.

These IC packages have proven surface mount (SMT) performance characteristics and have been designed to adapt easily to ALL SMT proces

CSOIC Features

* CERAMIC / HERMETIC www.DataSheet4U.com CSOIC The CSOIC offers a variety of features:

* 28 lead count (Others available if supplied and tooled)

* 300 mil body size

* Hermetic solder sealed package

* High thermal conductive ceramic

* Gold lead finish

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