CSOIC Datasheet - Amkor Technology

CSOIC Ceramic Small Outline Integrated Circuit Package

data sheet Ceramic Small Outline Integrated Circuit Package (CSOIC) This is a ceramic version of the Plastic SOIC package. The CSOIC is a hermetic package consisting of a multilayer ceramic surrounding a "gullwing" formed leadframe. This package has leads extending from two sides of the package (dual). The package is hermetically solder sealed at 325° Centigrade. These IC packages have proven surface mount (SMT) performance characteristics and have been designed to adapt easily to ALL SMT proces.

CSOIC Features

* CERAMIC / HERMETIC www.DataSheet4U.com CSOIC The CSOIC offers a variety of features:

* 28 lead count (Others available if supplied and tooled)

* 300 mil body size

* Hermetic solder sealed package

* High thermal conductive ceramic

* Gold lead finish

CSOIC_AmkorTechnology.pdf

CSOIC Datasheet Preview — Preview of CSOIC PDF

Datasheet Details

Part number:

CSOIC

Manufacturer:

Amkor Technology

File Size:

392.27 KB

Description:

Ceramic small outline integrated circuit package.

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CSOIC CSOIC Ceramic Small Outline Integrated Circuit Package Amkor Technology

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