CSOIC Datasheet (Amkor Technology) - Ceramic Small Outline Integrated Circuit Package

CSOIC, Ceramic Small Outline Integrated Circuit Package

data sheet Ceramic Small Outline Integrated Circuit Package (CSOIC) This is a ceramic version of the Plastic SOIC package.

The CSOIC is a hermetic package consisting of a multilayer ceramic surrounding a "gullwing" formed leadframe.

This package has leads extending from two sides of the package (dual).

The package is hermetically solder sealed at 325° Centigrade.

These IC packages have proven surface mount (SMT) performance characteristics and have been designed to adapt easily to ALL SMT proces

CSOIC Features

* CERAMIC / HERMETIC www.DataSheet4U.com CSOIC The CSOIC offers a variety of features:

* 28 lead count (Others available if supplied and tooled)

* 300 mil body size

* Hermetic solder sealed package

* High thermal conductive ceramic

* Gold lead finish