Part number:
CSOIC
Manufacturer:
Amkor Technology
File Size:
392.27 KB
Description:
Ceramic small outline integrated circuit package.
Datasheet Details
Part number:
CSOIC
Manufacturer:
Amkor Technology
File Size:
392.27 KB
Description:
Ceramic small outline integrated circuit package.
CSOIC, Ceramic Small Outline Integrated Circuit Package
data sheet Ceramic Small Outline Integrated Circuit Package (CSOIC) This is a ceramic version of the Plastic SOIC package.
The CSOIC is a hermetic package consisting of a multilayer ceramic surrounding a "gullwing" formed leadframe.
This package has leads extending from two sides of the package (dual).
The package is hermetically solder sealed at 325° Centigrade.
These IC packages have proven surface mount (SMT) performance characteristics and have been designed to adapt easily to ALL SMT proces
CSOIC Features
* CERAMIC / HERMETIC www.DataSheet4U.com CSOIC The CSOIC offers a variety of features:
* 28 lead count (Others available if supplied and tooled)
* 300 mil body size
* Hermetic solder sealed package
* High thermal conductive ceramic
* Gold lead finish
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