Description
4 Ordering Options 5
Valid Combinations
Standard 5 Signal Description and Assignment 6 Package Options 7
48-Pin TSOP (Top View) 7 63-Ball FBGA (Balls Down, Top View) 8 Architecture 9 Memory Array Architecture & Addressing 9 Status Register Definition 10 Identification Definition (Address 00h) 11 Identification Definition (Address 20h) 12 Parameter Page Structure & Values 12 Bus Interface 16 Standby 16 Busy 16 Device Protection (Write Protect WP#) 16 Command Input 17 Address
Features
- Interface.
- Open NAND Flash Interface (ONFI 1.0) compliant.
- x8, x16.
- Technology.
- Single-level cell (SLC).
- 3xnm NAND Process.
- Operating Voltage Range.
- VCC: 2.70V.
- 3.60V.
- Operating Temperature Range.
- Industrial: -40°C to 85°C.
- Packages.
- 48-pin TSOP (12.0mm x 20mm).
- 63-ball FBGA (9mm x 11mm).
- Device Signature.
- Manufacturer’s ID.
- Device ID.
- Device Parameters (ONFI).
- Unique ID.