n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applications n Ultra-low resistance
MF-NSML175 - Low Ohmic PTC Resettable Fuses
(BOURNS)
Features
n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applicat.
MF-NSML190 - Low Ohmic PTC Resettable Fuses
(BOURNS)
Features
n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applicat.
MF-NSML200 - Low Ohmic PTC Resettable Fuses
(BOURNS)
Features
n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applicat.
MF-NSML260 - Low Ohmic PTC Resettable Fuses
(BOURNS)
Features
n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applicat.
MF-NSML300 - Low Ohmic PTC Resettable Fuses
(BOURNS)
Features
n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applicat.
MF-NSML350 - Low Ohmic PTC Resettable Fuses
(BOURNS)
Features
n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applicat.
MF-NSML380 - Low Ohmic PTC Resettable Fuses
(BOURNS)
Features
n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applicat.
MF-NSML400 - Low Ohmic PTC Resettable Fuses
(BOURNS)
Features
n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applicat.
MF-NSML450 - Low Ohmic PTC Resettable Fuses
(BOURNS)
Features
n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applicat.
MF-NSML500 - Low Ohmic PTC Resettable Fuses
(BOURNS)
Features
n Surface mount packaging for automated assembly n Small footprint size (1206) and low profile for space-constrained mobile applicat.