CP20100S
CITC
450.98kb
Trench schottky rectifier.
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CP2010N3A - TRIACS
(JILIN SINO)
R
TRIACS
CP2010N3A
MAIN CHARACTERISTICS
IT(RMS) VDRM IGT(I,II,III)
20A 800V 10mA
APPLICATIONS
AC switching Phase control
Packag.
CP2012-20A0897 - Multilayer Chip Couplers
(ACX)
CP 2012 Series
Multilayer Chip Couplers
Features
Monolithic SMD with small, low-profiled, and light-weight type.
Applications
0.8 ~ 6 GHz wireless .
CP201209 - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-050x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-070x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-101x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-102x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-110x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-121x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-130x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..