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PAC560GTL - HIGH PERFORMANCE GTL TERMINATION NETWORK

Key Features

  • 24 terminations in a single package.
  • 5 chip solution for all 119 GTL terminations.
  • High speed termination network.
  • Center ground pin placement reduces ground bounce and eases board layout.
  • Very low cross-talk.
  • Saves board space and reduces assembly cost.

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Datasheet Details

Part number PAC560GTL
Manufacturer California Micro Devices Corp
File Size 251.99 KB
Description HIGH PERFORMANCE GTL TERMINATION NETWORK
Datasheet download datasheet PAC560GTL Datasheet

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Full PDF Text Transcription (Reference)

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CALIFORNIA MICRO DEVICES PAC560GTL High Performance GTLTermination Network for Socket 370 Processors Features • 24 terminations in a single package • 5 chip solution for all 119 GTL terminations • High speed termination network • Center ground pin placement reduces ground bounce and eases board layout • Very low cross-talk • Saves board space and reduces assembly cost Applications • High Performance Servers • High Performance Desk Top Systems • Intel Celeron™ and Pentium™ CPUs Application Information High speed microprocessors demand unique, high speed bus termination. The PACGTL Termination Network provides 24 terminations per package and meets the requirements for high speed terminations. The termination resistor values are 56 or 120 ohms each.