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CP188 Datasheet - Central Semiconductor

CP188 - Small Signal Transistor NPN

PROCESS Small Signal Transistor NPN - Low Noise Amplifier Transistor Chip CP188 Central TM Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area www.DataSheet4U.com EPITAXIAL PLANAR 15 x 15 MILS 9.0 MILS 4.0 x 4.0 MILS 5.5 x 5.5 MILS Al - 30,000Å Au - 18,000Å Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 53,730 PRINCIPAL DEVICE TYPES CMPT2484 CMPT5088 CMPT5089 CMPT6428 CMPT6429 2N2484 BACKSID.

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CP188 Small Signal Transistor NPN Central Semiconductor