Datasheet Specifications
- Part number
- CPC1967
- Manufacturer
- Clare
- File Size
- 912.05 KB
- Datasheet
- CPC1967_Clare.pdf
- Description
- Power Relay
Description
i4-PAC™ Power Relay Characteristics Parameter Blocking Voltage Load Current, TA=25°C: With 5°C/W Heat Sink No Heat Sink On-Resistance RθJC 3.35 1.35 0.
Features
* a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low thermal resistance (0.35 °CCPC1967 Distributors
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