Part number:
CPC1967
Manufacturer:
Clare
File Size:
912.05 KB
Description:
Power relay.
i4-PAC™ Power Relay
Characteristics
Parameter
Blocking Voltage Load Current, TA=25°C: With 5°C/W Heat Sink No Heat Sink On-Resistance RθJC 3.35 1.35 0.
* a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low thermal resistance (0.35 °C
CPC1967
Clare
912.05 KB
Power relay.
i4-PAC™ Power Relay
Characteristics
Parameter
Blocking Voltage Load Current, TA=25°C: With 5°C/W Heat Sink No Heat Sink On-Resistance RθJC 3.35 1.35 0.
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