Datasheet Details
- Part number
- CPC1967
- Manufacturer
- Clare
- File Size
- 912.05 KB
- Datasheet
- CPC1967_Clare.pdf
- Description
- Power Relay
CPC1967 Description
i4-PAC™ Power Relay Characteristics Parameter Blocking Voltage Load Current, TA=25°C: With 5°C/W Heat Sink No Heat Sink On-Resistance RθJC 3.35 1.35 0.CPC1967 Features
* a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low thermal resistance (0.35 °C📁 Related Datasheet
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