CDBD8060-G Datasheet - Comchip Technology

Features

* -Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. TO-263/D2PAK -Low profile surface mounted application in order to optimize board space. 0.059(1.50) 0.031(0.80) 0.413(10.50) 0.394(10.00) 0.185(4.70) 0.169(4.30) 0.055(1.40) 0.047(1.