CZRV3-55C11 Features
* -Planar die construction. -200mW power dissipation. -Ideally suited for automated assembly process. -Ultra small surface mount package. Mechanical data -Case: SOT-323, Molded plastic -Terminals: Solderable per MIL-STD- 202G,method 208 -Polarity: See diagram below -Mounting position: Any Marking: see
CZRV3-55C2V4-G-ComchipTechnology.pdf
Datasheet Details
CZRV3-55C11, CZRV3-55C2V4-G
Comchip Technology
66.57 KB
Smd zener diodes.
This datasheet PDF includes multiple part numbers: CZRV3-55C11, CZRV3-55C2V4-G.
Please refer to the document for exact specifications by model.
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CZRV3-55C11 Distributor
