CYW20736S - Bluetooth Low Energy System-in-Package (SiP) Module
4 1.1 External Reset 4 1.2 32.768 kHz Oscillator 4 2.
Pin Map and Signal Descriptions 5 3.
Electrical Specifications 10 4.
RF Specifications 11 5.
ADC Specifications 12 6.
Timing and AC Characteristics 13 6.1 SPI Timing 13 6.2 BSC Interface Timing 14 6.3 UART Timing 15 7.
PCB Design and Manuf
CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module The CYW20736S is a compact, highly integrated Bluetooth Low Energy (BLE) system-in-package (SiP) module.
The CYW20736S SiP includes an embedded BLE antenna, 24 MHz clock, and 512 Kb EEPROM, so only a minimal set of external components is needed to create a standalone BLE device.
The CYW20736S is designed to accelerate time to market.
The Bluetooth stack and several application profiles are built into the module, allowing customers to
CYW20736S Features
* Applications
* ARM Cortex-M3 microcontroller unit (MCU)
* Embedded 512 Kb EEPROM
* Broadcom Serial Control (BSC), SPI, and UART interfaces
* FCC and CE compliant
* RoHS compliant, certified lead- and halogen-free
* Moisture Sensitivity Level (MSL) 3 compliant
* 6.5 mm ×
