* Applications
* ARM Cortex-M3 microcontroller unit (MCU)
* Embedded 512 Kb EEPROM
* Broadcom Serial Control (BSC), SPI, and UART interfaces
* FCC and CE compliant
* RoHS compliant, certified lead- and halogen-free
* Moisture Sensitivity Level (MSL) 3 compliant
* 6.5 mm ×
CYW20736S
Cypress Semiconductor
1.31 MB
Bluetooth low energy system-in-package (sip) module.
CYW20736S
Bluetooth Low Energy System-in-Package (SiP) Module
The CYW20736S is a compact, highly integrated Bluetooth Low Energy (BLE) system-in-pack.
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