RGP108 Features
* MECHANICAL SPECIFICATION R PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) ACTUAL SIZE OF DO-41 PACKAGE SERIES RGP100 - RGP
Datasheet Details
RGP108, RGP100
DIOTEC
251.65 KB
1 amp high reliability fast recovery diodes.
This datasheet PDF includes multiple part numbers: RGP108, RGP100.
Please refer to the document for exact specifications by model.
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