* 500mW Power Dissipation on Ceramic PCB Very Tight Tolerance on VZ Ideally Suited for Automated Assembly Processes Lead Free By Design/RoHS Compliant (Note 2) Dim A B H G D SOD-123 Min 3.55 2.55 1.40
* 0.45 0.25
* 0° Max 3.85 2.85 1.70 1.35 0.65
* 0.10
DDZ970x
DIODES ↗ Incorporated
511.70 KB
(ddz9681 - ddz9717) surface mount precision zener diode.
SPICE MODELS: DDZ9689 DDZ9690 DDZ9691 DDZ9692 DDZ9693 DDZ9694 DDZ9696 DDZ9697 DDZ9698 DDZ9699 DDZ9700 DDZ9701 DDZ9702
DDZ9703 DDZ9705 DDZ9707 DDZ9708 .
📁 Related Datasheet
DDZ9700 - SURFACE MOUNT PRECISION ZENER DIODE
(Diodes Incorporated)
DDZ9678 - DDZ9717
SURFACE MOUNT LOW CURRENT ZENER DIODE
Features
500mW Power Dissipation on FR-4 PCB at TL = +75°C Specified at a Low Test Curren.
DDZ9700S - SURFACE MOUNT PRECISION ZENER DIODE
(Diodes)
Features
• Very Sharp Breakdown Characteristics • Very Tight Tolerance on VZ • Ideally Suited for Automated Assembly Processes • Very Low Leakage Curr.
DDZ9700T - SURFACE MOUNT PRECISION ZENER DIODE
(Diodes)
Features
Small, Low Profile Surface Mount Package Very Sharp Breakdown Characteristics Ideally Suited for Automated Assembly Processes Very Lo.
DDZ9701 - SURFACE MOUNT PRECISION ZENER DIODE
(Diodes Incorporated)
DDZ9678 - DDZ9717
SURFACE MOUNT LOW CURRENT ZENER DIODE
Features
500mW Power Dissipation on FR-4 PCB at TL = +75°C Specified at a Low Test Curren.
DDZ9701S - SURFACE MOUNT PRECISION ZENER DIODE
(Diodes)
Features
• Very Sharp Breakdown Characteristics • Very Tight Tolerance on VZ • Ideally Suited for Automated Assembly Processes • Very Low Leakage Curr.
DDZ9701T - SURFACE MOUNT PRECISION ZENER DIODE
(Diodes)
Features
Small, Low Profile Surface Mount Package Very Sharp Breakdown Characteristics Ideally Suited for Automated Assembly Processes Very Lo.
DDZ9702 - SURFACE MOUNT PRECISION ZENER DIODE
(Diodes Incorporated)
DDZ9678 - DDZ9717
SURFACE MOUNT LOW CURRENT ZENER DIODE
Features
500mW Power Dissipation on FR-4 PCB at TL = +75°C Specified at a Low Test Curren.
DDZ9702S - SURFACE MOUNT PRECISION ZENER DIODE
(Diodes)
Features
• Very Sharp Breakdown Characteristics • Very Tight Tolerance on VZ • Ideally Suited for Automated Assembly Processes • Very Low Leakage Curr.
