PF6HZ
FEATURES
MECHANICAL SPECIFICATION
PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
ACTUAL SIZE OF DO-27 PACKAGE
SERIES GP400
- GP410 DO
- 27
LL BD (Dia)
EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES LOW FORWARD VOLTAGE DROP 4A at TA = 75 o C WITH NO THERMAL RUNAWAY
MECHANICAL DATA
Case: JEDEC DO-27 molded silica glass (U/L Flammability Rating 94V-0) Terminals: Plated axial leads Color Band Denotes Cathode BL
Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Color band denotes cathode Mounting Position: Any
Weight: 0.02 Ounces (0.7 Grams)
Ratings at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive loads, derate current by 20%.
PARAMETER (TEST CONDITIONS)
Series Number
Maximum DC Blocking Voltage Maximum RMS...
