* MECHANICAL SPECIFICATION SDB PACKAGE SHOWN ACTUAL SIZE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE INTEGRALLY MOLDED HEAT SINK PROVI
SDB4001
Diotec Semiconductor
334.92 KB
(sdb4000 - sdb4010) 40 amp silicon bridge rectifiers.
www.DataSheet4U.com DIOTEC ELECTRONICS CORP. 18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958
Data Sheet N.
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