* Operating Temperature Range - Industrial Part : - 40°C ~ 85°C
* Package Type : - 162-ball FBGA, 8x10.5mm2, 1.1T, 0.5mm Ball Pitch - Lead & Halogen Free
* NAND
* Architecture (4G bits) - Input / Output Bus Width: 8-bits / 16-bits - Page size X8 : (4K+256spare) bytes (
FMN4ST4DCF-25IH Datasheet (6.32 MB)
FMN4ST4DCF-25IH
Dosilicon
6.32 MB
1.8v nand flash memory and mobile ddr2.
FMN4xT4DCF-25Ix
FMN4xT4DCF-25IH Datasheet
* Do not leave this document unattended.
* This information contained in this document cove.
📁 Related Datasheet
FMN4ST2TCK-25IF Stacked Multi-Chip Product (FIDELIX)
FMN4ST2TCK-25IG Stacked Multi-Chip Product (FIDELIX)
FMN4ET2TCK-25IF Stacked Multi-Chip Product (FIDELIX)
FMN4ET2TCK-25IG Stacked Multi-Chip Product (FIDELIX)
FMN4ET4DCF-25IH 1.8V NAND Flash Memory and Mobile DDR2 (Dosilicon)
FMN-1056S Silicon Diode (Sanken electric)
FMN-1106S Fast Recovery Diode (Sanken electric)
FMN-1156S Fast Recovery Diode (Sanken)
FMN-1206S Fast Recovery Diode (Sanken electric)
FMN-2206S Silicon Diode (Sanken electric)
