708SRAP-R-AU-01 - AlGaInP Red LED chip
708SRAP-R-AU-01 Features
* (1) High luminous intensity (2) Long operation life (3) 100% probing test (4) Low driving current applications Characteristics: (1) Size Chip Size: 8 mil x 8 mil (203±25 µm x 203±25 µm) Chip Thickness: 7 mil (180±25µm ) typical Bonding Pad: 6 mil (152±10 µm) in diameter (2) Metallization: P electro
