FBM-10-160808-152T Datasheet (358.36 KB)
FBM-10-160808-152T
ETC
358.36 KB
Multilayer chip beads.
SPECIFICATION OF FBM
*-10 SERIES
APPLICATIONS 1. EMI suppression for various electric equipment by the addition of impedance to the circuit. 2..
📁 Related Datasheet
FBM-10-160808-102T - Multilayer Chip Beads
(ETC)
SPECIFICATION OF FBM□-10 SERIES
APPLICATIONS 1. EMI suppression for various electric equipment by the addition of impedance to the circuit. 2. It is p.
FBM-10-160808-121T - Multilayer Chip Beads
(ETC)
SPECIFICATION OF FBM□-10 SERIES
APPLICATIONS 1. EMI suppression for various electric equipment by the addition of impedance to the circuit. 2. It is p.
FBM-10-160808-221T - Multilayer Chip Beads
(ETC)
MULTILAYER CHIP BEADS
FBM-SERIES
APPLICATIONS 1. EMI suppression for various electric equipment by the addition of impedance to the circuit 2. It is.
FBM-10-160808-221T - Multilayer Chip Beads
(King Core)
SPECIFICATION OF FBM□-10 SERIES
APPLICATIONS 1. EMI suppression for various electric equipment by the addition of impedance to the circuit. 2. It is p.
FBM-10-160808-300T - Multilayer Chip Beads
(ETC)
SPECIFICATION OF FBM□-10 SERIES
APPLICATIONS 1. EMI suppression for various electric equipment by the addition of impedance to the circuit. 2. It is p.
FBM-10-160808-301T - Multilayer Chip Beads
(ETC)
SPECIFICATION OF FBM□-10 SERIES
APPLICATIONS 1. EMI suppression for various electric equipment by the addition of impedance to the circuit. 2. It is p.
