Datasheet4U Logo Datasheet4U.com

KS57P2316 Datasheet - ETC

KS57P2316 Bonding Diagram

www.DataSheet4U.com BONDING DIAGRAM PRODUCT KS57P2316 PAGE REV NO. 1 80 75 70 65 61 5 60 10 55 Y = 4460um ID : -1552 -1997 X = 3620um 15 www.DataSheet4U.com CJ7235X 50 20 21 25 30 35 40 41 45 TITLE L/F MAT’L CHIP SIZE BACK METAL ALLOY42 3620x4460um BARE_Si CJ7235X #1 PKG TYPE DEV NAME LF PAD SIZE 80_QFP_1420C CJ7235X_Rev0_1420C 283x283 MIL S A M S U N G DOC. # : RK8011-05-03(1/2) www.DataSheet4U www.DataSheet4U.com 4U.com DataSheet 4 U .com THIS DRAWING CONTAINS CONFIDE.

KS57P2316 Datasheet (179.09 KB)

Preview of KS57P2316 PDF
KS57P2316 Datasheet Preview Page 2 KS57P2316 Datasheet Preview Page 3

Datasheet Details

Part number:

KS57P2316

Manufacturer:

ETC

File Size:

179.09 KB

Description:

Bonding diagram.

📁 Related Datasheet

KS57P2304 Microcontroller (Samsung Electronics)

KS57P21132 (KS57C21116 - KS57P21132) single-chip CMOS microcontroller (Samsung semiconductor)

KS57P21408 (KS57C21408 - KS57P21408) single-chip CMOS microcontroller (Samsung semiconductor)

KS57P21632 single-chip CMOS microcontroller (Samsung semiconductor)

KS57P21832 single-chip CMOS microcontroller (Samsung semiconductor)

KS57P2916 single-chip CMOS microcontroller (Samsung semiconductor)

KS57P01504 (KS57x0150x) single-chip CMOS microcontroller (Samsung semiconductor)

KS57P0408 (KS57x040x) single-chip CMOS microcontroller (Samsung semiconductor)

TAGS

KS57P2316 Bonding Diagram ETC

KS57P2316 Distributor