* ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case: DO-214AA (SMB) ‧Epoxy: UL 94V-0 rate flame retar
SMB2EZ5.1D5 Datasheet (167.99 KB)
SMB2EZ5.1D5
Eris
167.99 KB
Surface mount device.
SMB2EZxxD5 SERIES
Surface Mount Device
0.086 (2.20) 0.077 (1.95) 0.155 (3.94) 0.130 (3.30)
0.180 (4.57) 0.160 (4.06)
0.012 (0.305) 0.006 (0.152) 0.0.
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