LPA6836V Datasheet, Vias, Filtronic Compound Semiconductors

LPA6836V Features

• Vias
• 25 dBm Output Power at 1-dB Compression at 18 GHz
• 9.5 dB Power Gain at 18 GHz
• 55% Power-Added Efficiency
• Source Vias to Backside Metallization DR

PDF File Details

Part number:

LPA6836V

Manufacturer:

Filtronic Compound Semiconductors

File Size:

70.02kb

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📄 Datasheet

Description:

Medium power phemt with source vias. AND APPLICATIONS DIE SIZE: 15.4X14.2 mils (390x360 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 3.0X3.0 mils (75x75 µm) The F

LPA6836V Application

• Applications DIE SIZE: 15.4X14.2 mils (390x360 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 3.0X3.0 mils (75x75 µm) The FPA6836V is an Alumi

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LPA6836V

Filtronic Compound Semiconductors

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