• Part: 33662
  • Description: LIN Physical Layer
  • Manufacturer: Freescale Semiconductor
  • Size: 507.88 KB
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Datasheet Summary

Freescale Semiconductor Advance Information Document Number: MC33662 Rev. 7.0, 1/2014 LIN 2.1 / SAEJ2602-2, LIN Physical Layer The Local Interconnect Network (LIN) is a serial munication protocol, designed to support automotive networks in conjunction with a Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective munication with sensors and actuators when all the Features of CAN are not required. The three 33662 versions are designed to operate at different maximum baud rates. The 33662LEF and 33662BLEF, and the 33662SEF and 33662BSEF, offer a normal baud rate (20 kbps), and the 33662JEF and 33662BJEF, a slow baud rate (10...