MPXV4006DP Description
Pressure Freescale Semiconductor + MPXV4006 Rev 3, 1/2009 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated an.MPXV4006DP Features
* 2.5% Maximum Error over +10°C to +60°C with Auto Zero 5% Maximum Error over +10°C to +60°C without Auto Zero Durable Thermoplastic (PPS) Package Available in Surface Mount (SMT) or Through-Hole (DIP) Configurations Available with Standard FluorosilicMPXV4006DP Applications
* Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a sol
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