RG1A Datasheet | General Semiconductor

FEATURES DO-204AP 0.034 (0.86) 0.028 (0.71) DIA. 1.0 (25.4) MIN. 0.240 (6.1) MAX. 0.150 (3.8) 0.100 (2.5) DIA. 1.0 (25.4) MIN. - High temperature metallurgically bonded construction - Hermetically sealed package - Glass passivated cavity-free junction - 1.0 Ampere operation at TA=55°C with no thermal runaway - Typical IR less than 0.1µA - Capable of meeting environmental standards of MIL-S-19500 - Fast switching for high efficiency - High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension - MECHANICAL DATA Dimensions in inches and (millimeters) - Brazed-lead assembly is covered by Patent No. 3,930,306 Case: JEDEC DO204AP solid glass body Terminals: Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.02 ounce, 0.56 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS RG1B RG1D RG1G RG1J RG1K RG1M UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375” (9.5mm) lead length at TA=55°C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 1.0A Maximum full load reverse current, full cycle average 0.375” (9.5mm) lead length at Maximum DC reverse current at rated DC blocking voltage Maximum reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction and storage temperature range TA=25°C TA=100°C VRRM VRMS VDC I(AV) 50 35 50 100 70 100 200 140 200 400 280 400 1.0 600 420 600 800 560 800 1000 700 1000 Volts Volts Volts...