* ‧High density packaging provides higer productivity. ‧Stable convex terminal reduces assembly costs. ‧Compatible with flow and reflow soldering.
* Applications ‧Computer ‧Mobile phone ‧Camcorder ‧Portable audio ‧Battery charger ‧Hard Disk Driver
* Configuration CD HYC158 (10P8R) b1 b2
HYC124
HITANO
282.56 KB
Thick film chip resistor.
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