Datasheet Details
Part number:
HJ-531IMF
Manufacturer:
HongJia
File Size:
928.42 KB
Description:
ultra-lowpower Bluetooth
Features
* 14 4.5 Power Dissipation - 14 5 Reflow Soldering Information- 15 6 Notices for Ultrasound Welding - 16 7 Supply Information - 17 7.1 Model Definition - 17 7.2 Packaging method- 17 - TangShan HongJia Electronic Technology Co., Ltd. 1 Version History Table 1-1 Revision History No. Version Release
HJ-531IMF, ultra-lowpower Bluetooth
HJ-531IMF HJ-531IMF Ultra-small Chip (5mmx4.75mm,including ANT,1Mb Flash) ultra-low power Bluetooth 5.1 module Datasheet Data Sheet DataSheet version:V1.2 TangShan HongJia Electronic Technology Co., Ltd.
CATALOG HJ-531IMF 1 Version History - 1 2 Overview - 2 3 Hardware specification - 4 - 3.1 Package and dimensions - 4 3.2 Pin Definition- 6 Note: The brackets in "()" are the built-in standard UART transparent transmission firmware function.
If the chip is empty, this function is not available
HJ-531IMF Distributor
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