* 14 4.5 Power Dissipation - 14 5 Reflow Soldering Information- 15 6 Notices for Ultrasound Welding - 16 7 Supply Information - 17 7.1 Model Definition - 17 7.2 Packaging method- 17 - TangShan HongJia Electronic Technology Co., Ltd. 1 Version History Table 1-1 Revision History No. Version Release
HJ-531IMF Datasheet (928.42 KB)
HJ-531IMF
HongJia
928.42 KB
Ultra-lowpower bluetooth.
HJ-531IMF
HJ-531IMF Ultra-small Chip (5mmx4.75mm,including ANT,1Mb Flash) ultra-low power Bluetooth 5.1 module Datasheet Data Sheet
DataSheet version:.
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